Yung-Cheng
(YC) Lee, S. J. Archuleta Professor
Department of Mechanical Engineering
University of Colorado, Boulder, CO 80309-0427
Editor, ASME Journal of Electronic Packaging (http://electronicpackaging.org)
leeyc@colorado.edu (email);
(303)492-3393 (phone)
Yung-Cheng
(YC) Lee received his BSME degree from the National Taiwan University in 1978,
and the M.S. and Ph.D. degrees from the University of Minnesota, in 1982 and
1984, respectively.
Y. C. Lee is a Professor of Mechanical Engineering at the University of
Colorado - Boulder. From 2006 to 2012, he was the Director of DARPA Center on
Nanoscale Science and Technology for Integrated Micro/Nano-Electromechanical
Transducers (iMINT). From 1993 to
2002, he was the Associate Director of the NSF Center for Advanced
Manufacturing and Packaging of Microwave, Optical and Digital Electronics
(CAMPmode). Prior to joining the University, he was at AT&T Bell
Laboratories, Murray Hill, New Jersey. Dr.
Lee's research focuses on the integration of microelectromechanical
systems (MEMS) and nanoelectromechanical systems (NEMS) with microelectronic,
optoelectronic and microwave devices.
Dr. Lee is the Editor of ASME Journal of Electronic Packaging (2014 ¡V
2019). He was an Associate Editor of the journal from 2002 to 2004. He also
served as a Guest Editor for special issues on Packaging for Micro/Nano-Scale
Systems for IEEE Transaction on Advanced Packaging (2003, 2005 and 2007). He is
an ASME Fellow and has received the following awards: Presidential Young
Investigator (NSF, 1990); Outstanding Young Manufacturing Engineer Award (SME,
1992); Outstanding Paper Award (IEEE-ECTC, 1991); Outstanding Paper Award (ASME
J. of Electronic Packaging, 1993); Honorable
Mention Paper Award (IEEE Transactions on Advanced Packaging, 2003); Meritorious
Paper Award (GOMACTech-03); CU-ME Woodward Outstanding Mechanical Engineering
Faculty Award, 2005-2006; ASME Electronic and Photonic Packaging Division¡¦s
Mechanics Award in 2007; CU-ME Department Outstanding Service Award, 2008; ASME
InterPACK Achievement Award, 2013; CU-ME Department Woodward Award, 2014; and
CU-ME Department Outstanding Service Award, 2015.
2015 to present President and CEO, Kelvin Thermal
Technologies, Inc.
2014 to present Editor,
ASME Journal of Electronic Packaging
2011
to present S. J. Archuleta Endowed Professorship
2006
to 2012 Director, DARPA Center for Integrated
Micro/Nano-Electromechanical Transducers
2006 to 2012 Administrative Director, Nanomaterials
Characterization Facility
1999
to present Professor,
Mechanical Engineering
2001 to 2002 Acting
Director, CAMPmode, Boulder, Colorado
1993 to 2002 Associate
Director, CAMPmode, Boulder, Colorado
1993 to 1999 Associate
Professor, Mechanical Engineering
1989
to 1993 Assistant
Professor, Mechanical Engineering
1984
to 1989 Member
of Technical Staff, AT&T Bell Labs-Murray Hill
1980 to 1984
Research
Assistant,
University of Minnesota.
1.
Optoelectronic
packaging, John Wiley and Sons, editors: Alan R. Mickelson, N. Bassavahally, and Y. C. Lee, 1997.
2.
Manufacturing
challenges in electronic packaging, editors: Y. C. Lee and W. T. Chen, Chapman
and Hall Pub., 1998.
3.
Micro-
and Opto-Electronic Materials and Structures:
Physics, Mechanics, Design, Reliability, Packaging, Two-Volume Book, ed. by E.
Suhir, Y. C. Lee and C. P. Wong, Springer, 2007.
4.
MEMS
Packaging, editors: Y. C. Lee, Y. T. Cheng, and Ramesh Ramadoss, to be
published in 2017 by World Scientific Publishing.
Ten Recent Representative Publications
1.
Development
of Ultra-Thin Thermal Ground Planes by Using Stainless-Steel Mesh as Wicking
Structure, Shanshan Xu, Ryan John Lewis, Li-Anne Liew, Yung-Cheng Lee, Ronggui
Yang, IEEE/ASME Journal of Micro-Electro-Mechanical Systems Letters, October
2016, pp. 842-844.
2.
Characterization of Thin Film Dissolution in Water with in Situ Monitoring
of Film Thickness Using Reflectometry, A. Yersak, R. Lewis, J. Tran, Y.-C. Lee,
ACS Appl. Mater. Interfaces 2016, 8, 17622-17630.
3.
Use of a Gel Finger to Feel the Skin Temperatures of a Smartphone,
Akshay Sripada, Morgan Rohlfing, Raymond Vijaendreh, Brenden Spetzler, Ramsey
Abdulhamid, Aaron Porras, Y. C. Lee, Ashish Gupta and Enisa Harris, ASME. J. Electron. Packag. 2016;138(3):031001-031001-8.
4.
Probabilistic
distributions of pinhole defects in atomic layer deposited films on polymeric
substrates, Alex Yersak and Y.C. Lee, AVS Journal of Vacuum Science and
Technology, pp. 01A130-1 to 01A130-7, January 2016.
5.
Microfabricated ultra-thin all-polymer
thermal ground planes, Lewis R, Liew L-A, Xu S, Lee Y-C, Yang R., SCIENCE
BULLETIN 60(7):701-706 1 Apr 2015.
6.
A
Three-Dimensional Carbon Nano-Network for High Performance Lithium Ion
Batteries, Miao Tian, Wei Wang, Yang Liu, Katherine L. Jungjohann,
C. Thomas Harris, Yung-Cheng Lee, and Ronggui Yang, Nano Energy, Vol. 11, pp.
500-509, 2015.
7.
Thin
Flexible Thermal Ground Planes: Fabrication and Scaling Characterization, Ryan
Lewis, Shanshan Xu, Li-Anne Liew, Collin Coolidge, Ronggui Yang, Y.C. Lee,
IEEE/ASME Journal of Micro-Electro-Mechanical Systems, Vol. 24, pp.2040-2048,
2015.
8.
A
monolithic polyimide micro cryogenic cooler: design, fabrication and test, Y.
Wang, R. Leweis, R. Radebaugh,
M. M-H Lin, V. M. Bright
and Y. C. Lee, IEEE J. of Microelecromechanical
Systems, Vol. 23, pp. 934-943, 2014.
9.
Atmospheric pressure spatial atomic layer deposition web coating
with in situ monitoring of film thickness, A. Yersak, Y. Lee, J. Spencer, M. Groner, Journal of Vacuum Science and Technology A,
32:01A130, 2014.
10.
Self-assembled
lipid and membrane protein polyhedral nanoparticles, Tamara Basta,
Hsin-Jui Wu, Mary K. Morphew, Jonas Lee, Nilanjan Ghosh, Jeffery Lai, John M. Heumann,
Keeshia Wang, Y.C. Lee, Douglas C Rees, and Michael
Stowell, PNAS, 111: 670-674, 2014.
Representative
Committee Services for Professional Conferences
1. Editor,
ASME Journal of Electronic Packaging, 2014-present.
4. NSF
Workshop on Optoelectronic Packaging, 1991, workshop organizer.
5. NSF
Symposium on Optoelectronic Packaging Science, 1992, steering committee.
6. ASME
Symp. on the Manufacturing Aspects in Elec.
Packaging, 1992, symposium organizer.
7. NSF
Workshop on Optoelectronic Packaging, 1993, Program Chairman.
8. ASME
Symp. on the Manufacturing Aspects in Elec.
Packaging, 1993, symposium organizer.
9. NSF
International Workshop on Optoelectronic Packaging, 1994, program chair.
10. SPIE
Symposium on Optoelectronic Packaging, 1996, symposium co-organizer.
11. SPIE
Symp. on Micro-Optics Integration and Assemblies,
1998, symposium co-organizer.
12. IMAPS
Adv. Tech. Workshop on MEMS Packaging, 1999, Technical Program Co-chair.
13. ASME IMECE, Orlando,
November 5-11, 2005, Session Chair.
14. ASME IMECE, Chicago,
November 6-10, 2006, Session Chair.