Y. C. Lee, Professor of Department of Mechanical Engineering Director of DARPA Center on Nanoscale Science and Technology for Integrated Micro/Nano-Electromechanical Transducers (iMINT); http://imintcenter.org Administrative Director of Nanomaterials Characterization Facility (NCF); http://ncf.colorado.edu leeyc@colorado.edu (email); (303)492-3393 (phone); (303)492-3498 (FAX)

Yung-Cheng (YC) Lee received his BSME degree from the National Taiwan University in 1978, and the M.S. and Ph.D. degrees from the University of Minnesota, in 1982 and 1984, respectively.

Y. C. Lee is a Professor of Mechanical Engineering and the Director of DARPA Center on Nanoscale Science and Technology for Integrated Micro/Nano-Electromechanical Transducers (iMINT) at the University of Colorado - Boulder. He is also the Administrative Director of the Nanomaterials Characterization Facility. From 1993 to 2002, he had been the Associate Director of the NSF Center for Advanced Manufacturing and Packaging of Microwave, Optical and Digital Electronics (CAMPmode). Prior to joining the University, he was at AT&T Bell Laboratories, Murray Hill, New Jersey. Dr. Lee's research focuses on the integration of microelectromechanical systems (MEMS) and nanoelectromechanical systems (NEMS) with microelectronic, optoelectronic and microwave devices. Dr. Lee was an Associated Editor of ASME Journal of Electronic Packaging (2001-2004) and a Guest Editor for special issues on Packaging for Micro/Nano-Scale Systems for IEEE Transaction on Advanced Packaging (2003, 2005 and 2007). He is an ASME Fellow and has received the following awards: Presidential Young Investigator (NSF, 1990); Outstanding Young Manufacturing Engineer Award (SME, 1992); Outstanding Paper Award (IEEE-ECTC, 1991); Outstanding Paper Award (ASME J. of Electronic Packaging, 1993); Honorable Mention Paper Award (IEEE Transactions on Advanced Packaging, 2003); Meritorious Paper Award (GOMACTech-03); CU-ME Woodward Outstanding Mechanical Engineering Faculty Award, 2005-2006; and ASME Electronic and Photonic Packaging Division’s Mechanics Award in 2007.

Appointments

2006 to present Director, Center for Inte. Micro/Nano-Electromechanical Transducers

2006 to present Administrative Director, Nanomaterials Characterization Facility

1999 to present Professor, Mechanical Engineering

2001 to 2002 Acting Director, CAMPmode, Boulder, Colorado

1993 to 2002 Associate Director, CAMPmode, Boulder, Colorado

1993 to 1999 Associate Professor, Mechanical Engineering

1989 to 1993 Assistant Professor, Mechanical Engineering

1984 to 1989 Member of Technical Staff, AT&T Bell Labs-Murray Hill

1980 to 1984 Research Assistant, University of Minnesota.

Books Published

1. Optoelectronic packaging, John Wiley and Sons, editors: Alan R. Mickelson, N. Bassavahally, and Y. C. Lee, 1997.

2. Manufacturing challenges in electronic packaging, editors: Y. C. Lee and W. T. Chen, Chapman and Hall Pub., 1998.

3. Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging, Two-Volume Book, ed. by E. Suhir, Y. C. Lee and C. P. Wong, Springer, 2007.

Ten Recent Representative Publications

1. Dielectric Asymmetric Trilayer Cantilever Probe for Calorimetric High Frequency Field Imaging; S. Lee, T. M. Wallis, J. Moreland, P. Kabos, and Y. C. Lee, ASME/IEEE Journal of Microelectromechanical Systems, Vol. 16, No. 1, pp.78-85, 2007.

2. Packaging and Reliability for Foundry-Fabricated MEMS; Y. C. Lee, a chapter in Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging, Ed. by Ephraim Suhir, C. P. Wong and Y. C. Lee, Springer, 2007.

3. RF MEMS Capacitive Switches Fabricated Using Printed Circuit Processing Techniques; R. Ramadoss, S. Lee, Y.C. Lee, V.M. Bright, and K.C. Gupta, IEEE/ASME Journal of Microelectromechanical Systems, 2006, pp. 1595 – 1604.

4. Near Field Imaging of High Freq. EM Fields with Calorimetric Cantilever Probes; S. Lee, T. M. Wallis, J. Moreland, P. Kabos, and Y. C. Lee, J. Appl. Phys. 99, 08H306, 2006.

5. Soldering Technology for Optoelectronic Packaging; Qing Tan, Y. C. Lee and M. Itoh, Chapter 5 in Passive Micro-Optical Alignment Methods, ed. R. Boudreau, CRC Press, 2005.

6. Forcing a Planar Jet Flow Using MEMS; T. Peacock, E. Bradley, J. Hertzberg and Y. C. Lee, Experiments in Fluids, Vol 37, pp. 22-28, 2004.

7. Tether- and Post- Enabled Flip-Chip Assembly for Manufacturable RF-MEMS; F. F. Faheem, and Y.C. Lee , Sensors and Actuators, vol. A-114, no. 2-3, pp.486-495, 2004.

8. Reliability testing of flexible circuit-based RF MEMS capacitive switches; S. Lee, R. Ramadoss, K. Gupta, Y. C. Lee, and V. Bright, Microelectronics Reliability, 2004, 245-250.

9. Solder-assembled Large MEMS Flap for Fluid Mixing; Z. Ma, Y. C. Lee, T. Peacock, E. Bradeley, J. Hertzberg, IEEE Tran. on Advanced Packaging, 2003, pp. 268-276.

10. Packaging for Microelectromechanical and Nanoelectromechanical Systems; Y. C. Lee, B. A. Parviz, A. Chiou and S. Chen, IEEE Tran. on Advanced Packaging, 2003, pp. 217-226.

Representative Committee Services for Professional Conferences

1. NSF Workshop on Optoelectronic Packaging, 1991, workshop organizer.

2. NSF Symposium on Optoelectronic Packaging Science, 1992, steering committee.

3. ASME Symp. on the Manufacturing Aspects in Elec. Packaging, 1992, symposium organizer.

4. NSF Workshop on Optoelectronic Packaging, 1993, Program Chairman.

5. ASME Symp. on the Manufacturing Aspects in Elec. Packaging, 1993, symposium organizer.

6. NSF International Workshop on Optoelectronic Packaging, 1994, program chair.

7. SPIE Symposium on Optoelectronic Packaging, 1996, symposium co-organizer.

8. ASME International Intersociety Electronic Packaging Conf., 1997; Technical Program Chair.

9. SPIE Symp. on Micro-Optics Integration and Assemblies, 1998, symposium co-organizer.

10. ASME International Intersociety Electronic Packaging Conf., 1999, Technical Program Chair.

11. IMAPS Adv. Tech. Workshop on MEMS Packaging, 1999, Technical Program Co-chair.

12. ASME IMECE, Nashville, TN, November 15-18, 1999, organizer of a panel session.

13. ASME International Intersociety Electronic Packaging Conference, 2001; General Chair.

14. ASME International Intersociety Electronic Packaging Conf., 2003; Advisory Board, Track Chair.

15. ASME IMECE, Washington DC, November 15-21, 2003, Session Chairs.

16. ASME IMECE, Anaheim, CA, November 13-19, 2004, Session Chairs.

17. ASME International Intersociety Electronic Packaging Conference, 2005, Advisory Board, Session Chairs.

18. ASME IMECE, Orlando, November 5-11, 2005, Session Chair.

19. ASME IMECE, Chicago, November 6-10, 2006, Session Chair.