Y. C. Lee, S. J. Archuleta Professor
Professor of Department of Mechanical Engineering
Director of DARPA Center on Nanoscale Science and Technology for Integrated Micro/Nano-Electromechanical Transducers (iMINT); http://imintcenter.org
leeyc@colorado.edu (email); (303)492-3393 (phone); (303)492-3498 (FAX)


Yung-Cheng (YC) Lee received his BSME degree from the National Taiwan University in 1978, and the M.S. and Ph.D. degrees from the University of Minnesota, in 1982 and 1984, respectively.

Y. C. Lee is a Professor of Mechanical Engineering and the Director of DARPA Center on Nanoscale Science and Technology for Integrated Micro/Nano-Electromechanical Transducers (iMINT) at the University of Colorado - Boulder. From 1993 to 2002, he had been the Associate Director of the NSF Center for Advanced Manufacturing and Packaging of Microwave, Optical and Digital Electronics (CAMPmode). Prior to joining the University, he was at AT&T Bell Laboratories, Murray Hill, New Jersey. Dr.  Lee's research focuses on the integration of microelectromechanical systems (MEMS) and nanoelectromechanical systems (NEMS) with microelectronic, optoelectronic and microwave devices.  Dr. Lee was an Associated Editor of ASME Journal of Electronic Packaging (2001-2004) and a Guest Editor for special issues on Packaging for Micro/Nano-Scale Systems for IEEE Transaction on Advanced Packaging (2003, 2005 and 2007). He is an ASME Fellow and has received the following awards: Presidential Young Investigator (NSF, 1990); Outstanding Young Manufacturing Engineer Award (SME, 1992); Outstanding Paper Award (IEEE-ECTC, 1991); Outstanding Paper Award (ASME J. of Electronic Packaging, 1993); Honorable Mention Paper Award (IEEE Transactions on Advanced  Packaging, 2003); Meritorious Paper Award (GOMACTech-03); CU-ME Woodward Outstanding Mechanical Engineering Faculty Award, 2005-2006; ASME Electronic and Photonic Packaging DivisioníŽs Mechanics Award in 2007; and CU-ME Department Outstanding Service Award, 2008.



2011 to present                 S. J. Archuleta Endowed Professorship

2006 to present                 Director, DARPA Center for Integrated Micro/Nano-Electromechanical Transducers

2006 to 2012                     Administrative Director, Nanomaterials Characterization Facility

1999 to present                 Professor, Mechanical Engineering

2001 to 2002                     Acting Director, CAMPmode, Boulder, Colorado

1993 to 2002                     Associate Director, CAMPmode, Boulder, Colorado

1993 to 1999                     Associate Professor, Mechanical Engineering

1989 to 1993                     Assistant Professor, Mechanical Engineering

1984 to 1989                     Member of Technical Staff, AT&T Bell Labs-Murray Hill

1980 to 1984                    Research Assistant, University of Minnesota.


Books Published

1.    Optoelectronic packaging, John Wiley and Sons, editors: Alan R. Mickelson, N. Bassavahally, and Y. C. Lee, 1997.

2.    Manufacturing challenges in electronic packaging, editors: Y. C. Lee and W. T. Chen, Chapman and Hall Pub., 1998.

3.    Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging, Two-Volume Book, ed. by E. Suhir, Y. C. Lee and C. P. Wong, Springer, 2007.


Ten Recent Representative Publications


  1. Three-Dimensional Ni/TiO2 Nanowire Network for High Areal-Capacity Lithium-Ion Microbattery Applications, Wei Wang, Miao Tian, Aziz Abdulagatov, Steven George, Yung-Cheng Lee and Ronggui Yang, Nano Lett., 2012, 12 (2), pp. 655íV660. 
  2. Thermal Performance of a Flat Polymer Heat Pipe Heat Spreader Under High Acceleration, Christopher Oshman, Qian Li, Li-Anne Liew, Ronggui Yang, Y.C. Lee, and Victor M. Bright, Darin J. Sharar, Nicholas R. Jankowski, Brian C. Morgan, J. Micromech. Microeng.,  22 (2012) 045018 (12pp). 
  3. In-situ Inspection of Cracking in Atomic-Layer-Deposited Barrier Films on Surface and in Buried Structures, Yadong Zhang, Ronggui Yang, Steven M. George, Yung-Cheng Lee, Thin Solid Films 520 (2011) 251íV257.
  4.  The Development of Polymer-Based Flat Heat Pipes, Oshman, C., Bo Shi, Chen Li, Ronggui, Yang,  Lee, Y.C.,  Peterson, G.P., Bright, V.M., IEEE J. of Microelectromechanical Systems, pp.410 íV 417, 2011.
  5. Atomic Layer Deposition Enabled Interconnect Technology for Vertical Nanowire Arrays, Jen-Hau Cheng, Dragos Seghete, Myongjai Lee, John B. Schlager, Kris A. Bertness, Norman A. Sanford, Ronggui Yang, Steven M. George and Y.C. Lee, Sensors and Actuators: A. Physical 165 (2011), pp. 107-114.
  6.  Atomic Layer Deposition/Molecular Layer Deposition for Barrier Coatings, Flexible Thermal Ground Planes and Batteries, Keynote Speech, IntíŽl Symp. on Materials Science and Innovation for Sustainable Society, Osaka, Japan, Nov.28 - 30, 2011.
  7. Thermo-Mechanical Properties of Alumina Films Created Using Atomic Layer Deposition Technique, David C. Miller, Ross R. Foster, Shih-Hui Jen, Jacob A. Bertrand, Shawn J. Cunningham, Arthur S. Morris, Yung-Cheng Lee, Steven M. George, and Martin L. Dunn, Sensors and Actuators A. 164, 2010, 58-67.
  8. Fluorescent Tags to Visualize Defects in Al2O3 Thin Films Grown Using Atomic Layer Deposition, Yadong Zhang, Yu-Zhong Zhang, David C. Miller, Jacob A. Bertrand, Ronggui Yang, Martin L. Dunn, Steven M. George and Y. C. Lee, Thin Solid Films, Vol. 517, pp. 6794-6797, 2009.
  9. Thermomechanical Properties of Aluminum Alkoxide (alucone) Films Created Using Molecular Layer Deposition, David C. Miller, Ross R. Foster, Shih-Hui Jen, Jacob A. Bertrand, Dragos Seghete, Byunghoon Yoon, Yung-Cheng Lee, Steven M. George, and Martin L. Dunn, Acta Materialia, 57(17), 2009, pp. 5083-5092.
  10.  GaN Nanowire Functionalized with Atomic Layer Deposition Techniques for Enhanced Immobilization of Biomolecules, D. J. Guo, A. I. Abdulagatov, D. M. Rourke, K. A. Bertness, S. M. George, Y. C. Lee, and W. Tan, Langmuir, 2010, 26 (23), pp. 18382íV18391.


Representative Committee Services for Professional Conferences


1.    NSF Workshop on Optoelectronic Packaging, 1991, workshop organizer.

2.    NSF Symposium on Optoelectronic Packaging Science, 1992, steering committee.

3.    ASME Symp. on the Manufacturing Aspects in Elec. Packaging, 1992, symposium organizer.

4.    NSF Workshop on Optoelectronic Packaging, 1993, Program Chairman.

5.    ASME Symp. on the Manufacturing Aspects in Elec. Packaging, 1993, symposium organizer.

6.    NSF International Workshop on Optoelectronic Packaging, 1994, program chair.

7.    SPIE Symposium on Optoelectronic Packaging, 1996, symposium  co-organizer.

8.    SPIE Symp. on Micro-Optics Integration and Assemblies, 1998, symposium co-organizer.

9.    IMAPS Adv. Tech. Workshop on MEMS Packaging, 1999, Technical Program Co-chair.

10.  ASME IMECE, Orlando, November 5-11, 2005, Session Chair.

11.  ASME IMECE, Chicago, November 6-10, 2006, Session Chair.

  1. Track Chair of Panel Sessions, IEEE ITherm 2012.
  2. Advisory Board, IntíŽl Symp. on Materials S. for Sustainable Society, Japan, 2011.
  3. ASME International Intersociety Electronic Packaging Conference, Advisory Committee (2011, 09, 07, 05, & 03), General Chair (2001), Technical Chair (1999), Track Chairs (2011)