Ronggui Yang

(For updated CV in PDF, click here)

Assistant Professor of Mechanical Engineering

Sanders Faculty Fellow in Engineering

University of Colorado at Boulder 

 

NEXT Lab    Open Positions    News

 

CONTACT INFORMATION:

Department of Mechanical Engineering

University of Colorado at Boulder

Boulder, CO 80309-0427

 

Email:  Ronggui.Yang@Colorado.Edu

Tel: (303) 735-1003  Fax: (303) 492-3498                             

Office: ECME 136, 427 UCB

 

Post-Doctor Offices: ECME 251A, ECME 251B

Student Offices and Labs: ECME 165, ECME 219, ECME 1B80

 

Research Group: Nano-enabled Energy Conversion, Storage, and Thermal Management Group (NEXT)

  

Research Interests:

·        Micro/Nanoscale and Ultrafast Transport Phenomena

·        Micro- and Nanotechnology for Energy Conversion and Storage

·        Micro/Nano-Enabled Thermal Management for Electronics and Optoelectronics

·        Nanostructured Materials (Nanocomposites, Hybrid Micro/Nano-Structures, Inorganic-Organic Hybrid Materials)

·        MEMS/NEMS and Micro-/Nano- Fabrication

 

EDUCATION:

·        Massachusetts Institute of Technology (MIT), GPA:5.0/5.0, Defended on November 18, 2005, Conferred in February 2006

Ph.D. in Mechanical Engineering (Heat Transfer), Minor: Solid State Electronics

Dissertation Title: Nanoscale Heat Conduction with Applications in Nanoelectronics and Thermoelectrics

Dissertation Advisor: Professor Gang Chen

Committee: Gang Chen, Mildred S. Dresselhaus, John H. Lienhard, Borivoje B. Mikic

·        University of California, Los Angeles (UCLA), GPA: 3.85/4.0, June 2001

M.S. in Mechanical Engineering (Micro-Electro-Mechanical Systems)

·        Tsinghua University, Beijing, China, GPA:85/100, July 1999

M.S. in Engineering Thermophysics

·        Xi’an Jiaotong University, Xi’an, China, GPA: 85/100, July 1996

      B.S. in Thermal Engineering

 

POSITIONS HELD:

01/2006 –     Assistant Professor of Mechanical Engineering, CU-Boulder.

09/2008-       Sanders Faculty Fellow, College of Engineering and Applied Science, CU-Boulder.

08/2005-12/2005  Adjunct Assistant Professor of Mechanical Engineering, CU-Boulder.

09/2001-12/2005  Graduate Research Assistant, Mechanical Engineering, MIT.

09/1999-07/2001  Graduate Research Assistant, Mechanical and Aerospace Engineering, UCLA.

09/1996-07/1999 Graduate Research Assistant, Thermal Engineering Department, Tsinghua University, Beijing, China.

 

AWARDS AND DISTINCTIONS:

2009-2014 National Science Foundation (NSF) CAREER Award (the National Science Foundation's most prestigious awards in support of junior faculty who exemplify the role of teacher-scholars through outstanding research, excellent education and the integration of education and research within the context of the mission of their organizations.)

2009 Selected as one of the <100 Invited Participants, the US National Academy of Engineering's (NAE) 15th U.S. Frontiers of Engineering Symposium.

2009 Biography featured as a technology developer with outstanding potential that could reverse the decline in the book “The Decline of American Technology” by Dr. Lynn G. Gref, to be published in Spring 2010.

2008 Technology Review’s TR35 Award (one of the 35 young scientists and technologists in world who are under the age of 35, but their work--spanning medicine, computing, communications, electronics, nanotechnology, energy, and more--is changing our world.)

2008 DARPA/MTO Young Faculty Award (one of the 39 rising stars in university microsystems research)

2008-2011 Sanders Faculty Fellow, College of Engineering and Applied Science, CU-Boulder.

2008 Outstanding Research Award, Department of Mechanical Engineering, CU-Boulder

2008 Nominated for IEEE/ACM William J. McCalla ICCAD 2008 Best Paper Award by the conference organizers of the 2008 International Conference on Computer-Aided Design (ICCAD).

2005 Best Paper Award – Research, InterPACK 2005 (the ASME/Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems), 1 out of 500+ papers.

2005 Goldsmid Award for Excellence in Research in Thermoelectrics, International Thermoelectrics Society.

2004 NASA Certificate of Recognition for a Technical Innovation (Space Act Tech Brief Award), NASA Inventions and Contributions Board.

 

AFFILIATIONS:

·        Department of Mechanical Engineering, University of Colorado at Boulder

Directing the research activities in the Nano-enabled Energy Conversion, Storage, and Thermal Management Systems (NEXT) Group including: (1) developing multi-carrier and multiscale simulation tools for electron and thermal transport in nanostructures and systems with embedded nanostructures, (2) building electrical and optical measurement systems to characterize thermal and electrical transport on the micro/nano~ and ultrafast scales including building two-color femtosecond pump-probe measurement systems [NIR-Blue and Visible-EUV] for studying  fundamental energy relaxation processes of electrons and phonons and for thermal imaging, (3) applications of micro/nano-technologies for energy conversion and storage, thermal management in electronics and photonics, controllable nonmanufacturing, and bio-medical instrumentation.

·        NSF Engineering Research Center for Extreme Ultraviolet Science and Technology

·        DARPA Focus Center on Nanoscale Science and Technology for Integrated Micro/Nano-Electromechanical Transducers (iMINT center)

 

PUBLICATIONS (Click here)

 

SHORT BIO:

Dr. Ronggui Yang is the Sanders faculty fellow in engineering and an assistant professor of Mechanical Engineering directing the Nano-enabled Energy Conversion, Storage, and Thermal Management Systems group (recently renamed from Nanoscale and Ultrafast Thermal Sciences and Applications –NUTS lab) at the University of Colorado at Boulder from January 2006. Dr. Ronggui Yang is also a faculty research scientist of the National Science Foundation Engineering Research Center for Extreme Ultraviolet Science and Technology (NSF EUV ERC) and the DARPA Focus Center on Nanoscale Science and Technology for Integrated Micro/Nano-Electromechanical Transducers (DARPA iMINT Center). Dr. Yang received his Ph.D degree focusing on Nanoscale Heat Transfer with Prof. Gang Chen in Mechanical Engineering from Massachusetts Institute of Technology (MIT) in December 2005 (conferred in February 2006). Prior to MIT, he had a master’s degree in MEMS from UCLA in 2001, a master’s degree in Engineering Thermophysics from Tsinghua University in Beijing in 1999, and a Bachelor’s degree in Thermal Engineering from Xi’an Jiaotong University in 1996. His research interests are on nanoscale and ultrafast thermal sciences, and their applications in energy and information technologies, controllable manufacturing, and biomedical engineering. His innovative research has won him numerous national and international awards including the 2009 NSF CAREER Award (the National Science Foundation's most prestigious awards in support of junior faculty who exemplify the role of teacher-scholars through outstanding research, excellent education and the integration of education and research), the 2008 MIT Technology Review’s TR35 Award (the 35 young scientists and technologists under the age of 35 whose work--spanning medicine, computing, communications, electronics, nanotechnology, and more--is changing our world), the 2008 DARPA Young Faculty Award (39 rising stars in university microsystems research), the 2005 Goldsmid Award for Research Excellence in Thermoelectrics (the only award from the International Thermoelectrics Society), the Best Research Paper Award from the ASME InterPACK 2005 Conference (1 out of more than 500 papers), and a NASA Tech Brief Award for a Technical Innovation in 2004. Upon arrival at CU-Boulder in January 2006, Dr. Yang’s group has been continuingly active in developing thermal management technologies for military and civilian devices and systems, developing theoretical and simulation tools for electron and thermal transport in nanostructures, developing low-to-high temperature thermal and thermoelectric property measurement systems for multifunctional materials, developing defect identification mechanisms for atomic layer deposition (ALD) enabled polymer-based flexible hermetic packaging for organic light emitting diode (OLED), and developing the optical pump-and-probe system (ultrafast thermal reflectance) to study the fundamental dynamics of electrons and phonons. Since January 2006, Dr. Ronggui Yang serves as a Principle Investigator or co-Principle Investigator for a few large-scale research projects at CU-Boulder. Dr. Ronggui Yang is an active member of ASME, IEEE, SAE, MRS, APS, and Sigma Xi. Dr. Ronggui Yang regularly serves as a referee or a panelist for about 30 prestigious academic journals including Science, Nano Letters, Physical Review Letters, Physical Review B, ASME transactions and IEEE Transactions, and federal funding agencies including Department of Energy (DOE) and National Science Foundation (NSF). Dr. Ronggui Yang is a track/symposium organizer or session chair for a number of ASME conferences on nanotechnology and heat transfer and a referee of many technical conference manuscripts. Dr. Ronggui Yang is a co-guest editor for a special issue on “Nanoscale Heat Transfer” in the Journal of Computational and Theoretical Nanosciences. Dr. Ronggui Yang currently holds seven pending patents (or paten disclosures) and has published more than 60 journal and conference papers on nanotechnology-enabled energy conversion and thermal management with an annual citation of >200 times in 2009 to his journal publications according to ISI Web of Science.

 

 

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