Nano-enabled
Energy Conversion, Storage and Thermal Management Systems (NEXT) Group
Director: Dr. Ronggui Yang, Associate
Professor of Mechanical Engineering
Office Location: ECME 273,
Tel: 303-735-1003 (O), Fax:
303-492-3498
People Research Publications Facilities Open Positions News
PUBLICATIONS AND PRESENTATIONS
(PDF links are given here
for academic use only. Preprints could be requested by sending emails to
Professor Ronggui Yang [Ronggui.Yang@Colorado.Edu] with full citation
information of the paper requested)
A).
BOOKS AND JOURNAL PUBLICATIONS
a).
Ph.D Dissertation
Ronggui Yang, Nanoscale Heat Conduction with Applications in Nanoelectronics and Thermoelectrics, MIT, Defended on November 18, 2005.
b).
Book Chapters
1. G. Chen, D. Borca-Tascuic and R.G. Yang, “Nanoscale Heat Transfer,” in “Encyclopedia of Nanoscience and Nanotechnology”, eds. H.S. Nalwa, Vol. 7, pp. 429-459, American Scientific Publishers, 2004. PDF
2. Suraj J. Thiagarajan, Wei Wang, and Ronggui Yang, “Nanocomposites as High Efficiency Thermoelectric Materials,” in Annual Review of Nano Research, Volume 3, ed. G.Z. Cao, Q.F. Zhang, and C.J. Brinker, World Scientific Publisher Co., Singapore, p. 447-492, 2009. PDF
3. Pilhwa Lee, Kurt Maute and Ronggui Yang, ‘An Extended Finite Element Method for the Analysis of Submicron Heat Transfer Phenomena,” book chapter in "Multiscale Methods in Computational Mechanics" in the Springer series “Lecture Notes in Applied and Computational Mechanics”, Vol. 55, pp. 195-212, 2011.
c). Editorial
·
G. Chen G, R. Yang, &
d).
Journal Papers Published or In Press
(Journal Publication Numbers and Citations according to ISI Web of Science as of May 10, 2012: Total items: 54, cited for 1147 times. Total Citations >1400 times according to Google Scholar as of March 31, 2012)
2012
63. Wei Wang, Dan Li, Miao Tian, Yung-Cheng Lee, and Ronggui Yang, Wafer-Scale Fabrication
of Silicon Nanowire Arrays with Controllable
Dimensions, Applied Surface Science, in Press.
62. Qing Li, Kathleen
Hoogeboom-Pot, Damiano Nardi, Margaret M. Murnane, and Henry C. Kapteyn, Mark
E. Siemens, Erik H. Anderson, Olav Hellwig and Bruce Gurney, Ronggui Yang, and Keith A. Nelson,
Generation and Control of Ultrashort-Wavelength 2D Surface Acoustic Waves at
Nano-interfaces, Physical Review B, in Press.
61. Dan Li, Gensheng
Wu, Wei Wang, Yunda Wang, Dong Liu, Dacheng Zhang, Yunfei Chen, G.P.
Peterson, and Ronggui Yang, Enhancing Flow Boiling Heat
Transfer in Microchannels
for Thermal Management with Monolithically-Integrated Silicon Nanowires, Nano Letters, (Submitted in January 2012 and Accepted with Revisions on February 29, 2012).
60.
Miao Tian, Wei Wang, Yujie
Wei and Ronggui Yang,
Three-Dimensional Ni-Sn Nanowire
Networks for Stable High Areal-Capacity Lithium Ion Battery Anodes, Journal of
Power Sources, Vol.
211, pp. 46-51, 2012, PDF.
59. Jun Zhou, Yuanyuan Wang, Jeff Sharp, and Ronggui Yang, Optimal Thermoelectric Figure of Merit in Bi2Te3/Sb2Te3 Quantum Dot Nanocomposites, Physical Review B, Vol. 85, Art #115320, 2012, PDF.
58. Xiaobo Li, and Ronggui Yang, Size-Dependent Phonon Transmission across Interfaces of Dissimilar Materials, Journal of Physics: Condensed Matter, Vol. 24, Art # 155302, 2012 PDF.
57. Christopher Oshman, Qian Li, Li-Anne Liew, Ronggui Yang, Y.C. Lee, and Victor M. Bright, Darin J. Sharar, Nicholas R. Jankowski, Brian C. Morgan, Thermal Performance of a Flat Polymer Heat Pipe Heat Spreader Under High Acceleration, Journal of Micromechanics and Microengineering, Vol. 22, Art #045018, 2012, PDF.
56. Jun Liu, Mohamed Alhashme, and Ronggui Yang, Thermal Transport across Carbon Nanotubes Connected by Molecular Linkers, Carbon, Vol. 50, pp. 1063-1070, 2012, PDF.
55. J. Ordonez-Miranda, Ronggui Yang and J. J. Alvarado-Gil, A Model for the Effective Thermal Conductivity of Metal-Nonmetal Particulate Composites, Journal of Applied Physics, Vol. 111， Art # 044319, 2012, PDF.
54. Wei Wang, Miao Tian, Aziz Abdulagatov, Steven George, Yung-Cheng Lee and Ronggui Yang, Three-Dimensional Ni/TiO2 Nanowire Network for High Areal-Capacity Lithium-Ion Microbattery Applications, Nano Letters, Vol. 12, pp 655–660, 2012, PDF.
2011
53. Jun Zhou, Ronggui Yang, Gang Chen and Mildred S. Dresselhaus, Optimal Bandwidth for High Efficiency Thermoelectrics, Physical Review Letters, Vol. 107, Art #
226601, 2011, PDF.
52. A.I. Abdulagatov, Y.W. Yan, J.R. Cooper, Y.D. Zhang, Z. Gibbs, A.Cavanagh, R.G. Yang, Y.C. Lee, and S.M. George, Al2O3 and TiO2 Atomic Layer Deposition on Copper for Water Corrosion Resistance, ACS Applied Materials and Interfaces, Vol. 3, pp 4593–4601, 2011, PDF.
51. Yuanyuan Wang, Jun Zhou and Ronggui Yang, Thermoelectric Properties
of Molecular Nanowires, Journal of Physical Chemistry
C, Vol. 115, pp
24418–24428, 2011, PDF.
50. Jun Zhou, and Ronggui Yang, Quantum and Classical
Thermoelectric Transport in Quantum Dot Nanocomposites,
Journal of Applied Physics, Vol. 110, Art # 084317, 2011, PDF.
49. Yadong Zhang, Ronggui Yang, Steven M. George, and Yung-Cheng Lee, In-Situ Inspection of Cracking in Atomic Layer Deposited Thin Films Using Laser Scanning Confocal Microscopy, Thin Solid Films, Vol. 520, p.251-257, 2011 PDF.
48. Miao Tian, Wei Wang, Se-Hee Lee, Yung-Cheng Lee, and Ronggui Yang, Enhancing Ni-Sn Nanowire Anode Performance of Lithium Ion Batteries by Tailoring Active/Inactive Material Interface, Journal of Power Sources, Vol. 196, pp. 10207-10212, 2011, PDF.
47. Yadong Zhang, Dragos Seghete, Aziz Abdulagatov, Zachary Gibbs, Andrew Cavanagh, Ronggui Yang, Steven George, and Y C Lee, Investigation of the Defect Density in Ultra-Thin Al2O3 Films Grown Using Atomic Layer Deposition, Surface and Coating Technologies, Vol. 205, pp. 3334-3337, 2011. PDF
46. J. Ordonez-Miranda, Ronggui Yang and J. J. Alvarado-Gil, On the Thermal Conductivity of Particular Nanocomposites, Applied Physics Letters, Vol. 98, Ar#233111, June 2011, PDF.
45. Xiaochun Wang, Ronggui Yang, Yong Zhang, Peihong Zhang，and Yu Xue, Rare earth chalcogenide Ce3Te4 as high efficiency high temperature thermoelectric material, Applied Physics Letters, Vol. 98, Art #222110, June 2011, PDF.
44. Jose Ordonez-Miranda, Ronggui Yang, and J.J. Alvarado-Gil, A New Constitutive Equation for Nano-to-Macro- Scale Heat Conduction Based on Boltzmann Transport Equation, Journal of Applied Physics, Vol. 109, Art # 084319, April 2011. PDF
43. Jun Zhou, and Ronggui Yang, Ballistic Thermoelectric Transport in Double-Bend Nanowires, Applied Physics Letters, Vol. 98, Art# 173107, April 2011. PDF
42. Chris Oshman, Bo Shi, Chen Li, Ronggui Yang, Y.C. Lee, G.P. “Bud” Peterson, and Victor Bright, Development of Thin Polymer-based Flat Heat Pipes, ASME/IEEE Journal of Micro-Electro-Mechanical Systems, Vol. 20, n2, pp. 410-417, 2011. PDF
41. Jose Ordonez-Miranda, Ronggui Yang, and J.J. Alvarado-Gil, The Effect of the Electron-Phonon Coupling on the Effective Thermal Conductivity of Metal-Nonmetal Multilayers, Journal of Applied Physics, Vol. 109, Art #094310, May 2011, PDF.
40. Jen-Hau Cheng, Dragos Seghete, Myongjai Lee, John B. Schlager, Kris A. Bertness, Norman A. Sanford, Ronggui Yang, Steven George and Y.C. Lee, “Atomic Layer Deposition Enabled Interconnect Technology for Vertical Nanowire Arrays,” Sensors & Actuators A: Physical (published online in January 2010), Vol. 165, pp. 107-114, 2011. PDF.
2010
39.
Mark Siemens, Qing Li, Ronggui Yang, Keith
A. Nelson, Eric Anderson, Margaret Murnane, and Henry
Kapteyn, Quasi-ballistic
thermal transport from nanoscale interfaces observed
using ultrafast coherent soft X-ray beams, Nature
Materials, Vol. 9, pp. 26-30, 2010, PDF. It has also been selected for the Virtual Journal of Nanoscale Science & Technology (Vol. 21, n1) http://www.vjnano.org.
38. Jie Zhu, Dawei Tang, Wei Wang, Jun Liu, Kristopher W Holub, and Ronggui Yang, Ultrafast Thermoreflectance Techniques for Measuring Thermal Conductivity and Interface Thermal Conductance of Thin Films, Journal of Applied Physics, 108, Art # 094315, 2010, PDF.
37. Min Wu, Hongbin Yao, Thomas Emge, Jen-Hau Cheng, Suraj Thiagarajan, Ronggui Yang, Mark
Croft, Xiaoying Huang, Jessica Rhee, Jing Li, An Iron
Sulfide Hybrid Semiconductor with Unique 2D [Fe16S20]8-
Layer and Low Thermal Conductivity, Chemical Communications, 46, pp. 2649-2651, 2010 PDF.
36. Jun Liu and Ronggui Yang, Tuning the Thermal Conductivity of Polymers with Mechanical Strain, Physical Review B, 81, Art # 174122, 2010 PDF.
35. Xiaobo Li,
Kurt Maute, Martin L. Dunn and Ronggui Yang, Strain Effects on the Thermal
Conductivity of Nanostructures, Physical Review B, 81, Art #245318, 2010 PDF. It has also been selected for the Virtual
Journal of Nanoscale Science & Technology (Vol.
22, n1) http://www.vjnano.org.
34. Jun Zhou, and Ronggui Yang, Thermoelectric Transport in
Strongly Correlated Quantum Dot Nanocomposites, Physical Review B, 82, 075324, 2010 PDF. It has also been selected
for the Virtual Journal of Nanoscale Science & Technology
(Vol. 22, n13) http://www.vjnano.org.
33. Jun Zhou, Xiaobo Li, Ronggui Yang, and Gang Chen, A Semi-Classical Model for Thermoelectric Nanocomposites, Physical Review B, Vol. 82, Art #. 115308, 2010 PDF.
32. Dae Up Ahn,
Zhen Wang, Ronggui Yang, and Yifu Ding, Hierarchical Polymer Patterns Driven by
Instabilities at Corrugated and Mobile Polymer-Polymer Interfaces, Soft Matter,
Vol. 6, p. 4900, 2010, PDF.
31. Sheng Shen, Ronggui Yang, and Gang Chen, Robert M Crone, and Manuel Anaya-Dufresne, Nonlocal Formulation of the Reynolds Equation for Rarefied Gas Flow With Steep Pressure Variation, Journal of Applied Physics, 107, Art # 104316, 2010 PDF.
2009
30. Mark Siemens, Qing Li, Margaret Murnane,
Henry Kapteyn, Ronggui
Yang, Erik Anderson, and Keith Nelson, High-Frequency Surface Acoustic Wave
Propagation in Nanostructures Characterized by Coherent Extreme Ultraviolet
Beams, Applied Physics Letters Vol. 94, Art # 093103, 2009 PDF. It has also been selected for the March 16, 2009 issue of Virtual
Journal of Nanoscale Science & Technology (Vol.
16, n9) http://www.vjnano.org.
29. David C. Miller, Ross R. Foster, Yadong
Zhang, Shih-Hui Jen, Jacob A. Bertrand, Zhixing Lu, Dragos Seghete, Jennifer L. O’Patchen, Ronggui Yang, Yung-Cheng Lee, Steven M.
George, and Martin L. Dunn,
The Mechanical Robustness of Atomic-Layer and Molecular-Layer Deposited
Coatings on Polymer Substrates, Journal of Applied Physics, Vol. 105, n9, Art #
093527, May 2009, PDF.
28. Xiaoying Huang, Mojgan
Roushan, Thomas J. Emge, Wenhua Bi, Suraj Joottu
Thiagarajan, Jen-Hau Cheng, Ronggui Yang, Jing Li, Flexible Hybrid Semiconductors Having Very Low Thermal
Conductivity: The Role of Organic Diamines, Angewandte Chemie International Edition (submitted in June 2009 and
accepted August 5, 2009), Vol. 121, pp. 8011-8014, September 2009. PDF.
27. Liang-Chun Liu, Mei-Jiau
Huang, Ronggui Yang, Ming-Shan
Jeng, and Chang-Chung Yang, Curvature Effect on the Phonon Thermal Conductivity
Reduction of Dielectric Nanowires, Journal of Applied
Physics, Vol. 105, n10, Art # 104313, May 2009. PDF. It has also been selected for the June 8, 2009 issue
of Virtual Journal of Nanoscale Science &
Technology (Vol. 19, n23) http://www.vjnano.org..
26. Yadong Zhang,
Yu-Zhong Zhang, David C. Miller, Jacob A. Bertrand, Ronggui Yang, Martin L. Dunn, Steven M.
George and Y. C. Lee, Fluorescent
Tags to Visualize Defects in Al2O3 Thin Films Grown Using Atomic Layer
Deposition, Thin Solid Films,
Vol. 517, pp. 6794-6798, October 2009 (published online in May 2009). PDF.
25. Nicholas Allec, Zyad
Hassan, Li Shang, Robert P. Dick, Vishak Venkatraman and Ronggui Yang, “ThermalScope: Multi-scale Thermal Analysis for Nanometer-scale
Integrated Circuits,” IEEE Transactions on Computer-Aided Design
of Integrated Circuits and Systems, Vol. 28, n6, pp. 860-873, 2009, PDF
24. Suresh Ramanan and Ronggui Yang, Effect of Gas Rarefaction on the Performance of Submicron Fins, Applied
Physics Letters, Vol. 94, Art# 143106,
2009, PDF. It has also been selected for the April 27,
2009 issue of Virtual Journal of Nanoscale Science
& Technology (Vol. 16, n17) http://www.vjnano.org.
23. Yadong Zhang, Jacob A. Bertrand, Ronggui Yang, Y. C. Lee, and Steven M.
George, Electroplating to visualize defects in Al2O3
thin films grown using atomic layer deposition, Thin Solid Films, Vol. 517, pp. 3269-3272, 2009
(published online in January 2009). PDF
22. Evgrafov, K. Maute, R.G. Yang, and M.L. Dunn, Topology Optimization for Nano-scale Heat Transfer (Published online in July 2008), International Journal for Numerical Methods in Engineering, Vol. 77, pp. 285–300, 2009 PDF.
2008
21. Ming-Shan Jeng, Ronggui Yang, David W. Song, and Gang Chen, Modeling the Thermal Conductivity and Phonon Transport in Nanoparticle Composites using Monte Carlo Simulation, ASME Journal of Heat Transfer (JHT), Vol. 130, Article #042410 (1-11), April 2008, PDF. As of Oct. 25, 2011, this paper has been cited for 33 times and ranks #1 in the citation record among all the 214 papers published in this journal in 2008 according to the web of science. In addition, This paper is among the 10 most downloaded articles among all online JHT papers (published in 1990-present) in May 2008, in June 2008, in September 200, in October 2008, in November 2008, in December 2008, in January 2009, in February 2009, in March 2009, in April 2009, and in May 2009 (ASME Journal of Heat Transfer website).
20. Weixue Tian and Ronggui Yang, Phonon Transport and Thermal Conductivity Percolation in Random Nanoparticle Composites (Invited Paper), Computer Modeling in Engineering and Sciences (CMES), Vol. 24, p.123-141, 2008, PDF.
19. T. Borca-Tasciuc, D. G. Cahill, G. Chen, S. B. Cronin, H. Daiguji, C. Dames, K. Fushinobu, T. Inoue, A. Majumdar, S. Maruyama, K. Miyazaki, M. Matsumoto, P. M. Norris, L. Shi, M. Shibahara, M. Shannon, J. Shiomi, Y. Taguchi, K. Takahashi, T. Tsuruta, S. G. Volz, E. Wang, X. F. Xu, B. Yang, and R.G. Yang, “Report on 6th US-Japan Joint Seminar on Nanoscale Transport PhenomenaScience and Engineering’, Nanoscale and Microscale Thermophysical Engineering, Vol. 12, pp. 273-293, 2008, PDF
18. Jianping Fu, Ronggui Yang, Gang Chen, G. Jeffrey Snyder and Jean-Pierre Fleurial, Integrated Electroplated Heat Spreaders for High Power Quantum Well Lasers, Journal of Applied Physics, Vol. 104, Art # 064907, 2008. PDF
2007
17. M. S. Dresselhaus, G. Chen, M.Y. Tang, R.G. Yang, H. Lee, D.Z. Wang, Z. F. Ren, J. P. Fleurial, and P. Gogna, New Directions for Low Dimensional Thermoelectric Materials (Invited Review), Advanced Materials 19, pp.1043-1053, April 2007, PDF. According to the ISI Web of Science, this paper has been cited 418 times as of Oct 25, 2011 and ranks #1 in the citation record out of the total 753 papers published in this journal in 2007. In addition, this paper also ranked as #2 of the top 20 most accessed articles in April 2007 (Advanced Materials journal website).
16. Weixue Tian and Ronggui Yang, Effect of Interface Scattering on Phonon Thermal Conductivity Percolation in Random Nanowire Composites, Applied Physics Letters 90, 263105, June 2007, PDF. It has also been selected for the July 9, 2007 issue of Virtual Journal of Nanoscale Science & Technology (Vol. 16, n2) http://www.vjnano.org.
15. Weixue Tian, and Ronggui Yang, Thermal Conductivity Modeling of Compacted Nanowire Composites, Journal of Applied Physics 101, 054320, March 2007. PDF
2006
2005
14. Ronggui Yang, Gang Chen, and Mildred S. Dresselhaus, Thermal Conductivity of Simple and Tubular Nanowire Composites in the Longitudinal Direction, Physical Review B 72, 125418, 2005, PDF. It has also been selected for the Sep 26, 2005 issue of Virtual Journal of Nanoscale Science & Technology (Vol. 12, n13) http://www.vjnano.org. As of Oct 25, 2011, this paper has been cited 87 times and is one of the top 100 highly cited papers out of the total 6266 Physical Review B papers published in 2005.
13. Ronggui Yang, Gang Chen, Marine Laroche and Yuan Taur, Multidimensional Transient Heat Conduction at Nanoscale using the Ballistic-Diffusive Equations and the Boltzmann Equation, ASME Journal of Heat Transfer, Vol. 127, pp.298-306, 2005, PDF. According to the ISI Web of Science, this paper has been cited 35 times as of October 25, 2011 and ranks #9 in the citation record out of the total 177 papers published in this journal in 2005.
12. Ronggui Yang, Gang Chen, and Mildred Dresselhaus, Thermal Conductivity Modeling of Core-Shell and Tubular Nanowires, Nano Letters, Vol. 5, pp. 1111-1115, June 2005, PDF.
11. Ronggui Yang, Arvind Narayanaswamy and Gang Chen, Surface Plasmon Coupled Nonequilibrium Thermoelectric Refrigerators and Power Generators, Journal of Computational and Theoretical Nanoscience, Vol. 2, pp. 75-87, 2005, PDF.
10. Ronggui Yang and Gang Chen, Nanostructured Thermoelectric Materials: From Superlattices to Nanocomposites (Invited Review), Materials Integration 18; pp. 31-36, Feature issue on “Thermoelectric Materials R&D in the World”, PDF.
9. Gang Chen, Ronggui Yang, and Xiaoyuan Chen, Nanoscale Heat Transfer and Thermoelectric Energy Conversion, Journal de Physique IV, Vol. 125, pp.499-504, 2005, PDF.
2004
8. Ronggui Yang and Gang Chen, Thermal Conductivity Modeling of Periodic Two-Dimensional Nanocomposites, Physical Review B, Vol. 69, 195316 (1-10), 2004, PDF. As of Oct 25, 2011, this paper has been cited 117 times and is one of the top 50 highly cited papers out of the total 5110 Physical Review B papers published in 2004.
7. Ronggui Yang, Gang Chen, A. Ravi Kumar, G. Jeffrey Snyder and Jean-Pierre Fleurial, Transient Cooling of Thermoelectric Micro Coolers and its Applications, Energy Conversion and Management, Vol. 46, pp.1407-1421, 2005 (published in Sep. 2004), PDF.
6. Ronggui Yang, Gang Chen, G. Jeffrey Snyder, and Jean-Pierre Fleurial, Multistage Thermoelectric Micro Coolers, Journal of Applied Physics, Vol. 95, pp. 8226-8232, 2004, PDF. It has also been selected for the June 21, 2004 issue of Virtual Journal of Nanoscale Science & Technology (Vol. 9, n24) http://www.vjnano.org.
<2002
5. G. Jeffrey Snyder, Jean-Pierre Fleurial, Thierry Caillat, Ronggui Yang and Gang Chen, Supercooling of Peltier Cooler using a Current Pulse, Journal of Applied Physics, Vol. 92, n3, pp.1564-1569, 2002, PDF.
4. Ronggui Yang, Shuye Lei and Jianhua Du, Transport Phenomena in Unsaturated Porous Media Due to Sudden Heating, Journal of Tsinghua University (in Chinese), Vol.39 n6, p78-82, 1999
3. Shuye Lei, Ronggui Yang and Jianhua Du, Research on Heat and Mass Transfer in Unsaturated Porous Media, Journal of Tsinghua University (in Chinese), Vol.39 n6, p.74-77, 1999.
2. Lihe Chai and Ronggui Yang, Philosophical Perspective on Modeling Methods, Exploration of Nature (Chinese), Vol. 18, n2, pp. 87-90, 1999.
1. Shuye Lei and Ronggui Yang, Seepage Model on Heat and Mass Transfer in Unsaturated Porous Media, Chinese Academic Journal, Vol. 4, n8, 1998.
e).
Journal Papers in Review or in Preparation
J1. David Makhija, Georg Pingen, Ronggui Yang, and Kurt Maute, Topology Optimization of Multi-component flows by Multi-relaxation Time Lattice Boltzmann Method, Submitted, May 2011.
J2.
Yujie Wei, Jiangtao Wu, Hanqing
Yin, Xinghua Shi, Ronggui Yang, Mildred S. Dresselhaus, The Nature of Strength Enhancement and
Weakening by Pentagon-Heptagon Defects in Graphene, April 2012.
J3.
Xiaobo
Li, and Ronggui Yang, The Effect of
Lattice Mismatch on Phonon Transmission and Interface Thermal Conductance
across Dissimilar Material Interfaces, May 2012.
J4.
Jun Liu, and Ronggui
Yang, Divergent Thermal Conductivity of Single Extended Polymer Chains, May
2012.
J5.
Christopher Oshman, Qian Li, Li-Anne Liew,
Ronggui Yang, Y.C. Lee, Victor
Bright,
Flexible Polymer
Thermal Ground Planes, May 2012.
J6.
Yujie Wei, et al, Determining the bending rigidity and the Gaussian
bending stiffness of graphene by ab initio calculations, May 2012
J7.
Qian Li,
Wei Wang, Benoit Latour, Chris Oshman,
C.H. Li, C. Li, Victor M. Bright, Yung-Cheng Lee, G.P. Peterson, and Ronggui Yang, Boiling
Heat Transfer on Hybrid Micro/Nano-Structured
Surfaces, May 2012.
J8.
Wei Wang, Miao Tian, Yung-Chen Lee, and Ronggui Yang, Silicon-Carbon Nanowire
Networks for High Capacity Lithium Ion Battery Anodes, 2012.
J9.
J.
Ordonez-Miranda, J. J. Alvarado-Gil, and Ronggui
Yang, Thermal Conductivity of Particulate
Composites at Non-dilute Limit, 2012.
J10.
Yuanyuan Wang, Jun Zhou, and Ronggui Yang, Thermoelectric Transport
across Polymer-Semiconductor-Polymer Nanoscale
Junctions, 2012.
J11.
Xiaobo Li, and Ronggui Yang, Modeling
the Lattice Thermal Conductivity of Si/Ge Nanocomposites using Equilibrium Molecular Dynamics
Simulations, 2012.
J12.
Jun Zhou and Ronggui Yang,
Hydrodynamic Model for Coupled Non-equilibrium Electron-Phonon Transport in
Metals after Ultrafast Laser Excitation, 2012.
J13.
Wei Wang, Miao Tian, Yujie Wei,
and Ronggui Yang, Nickel-Silicon Nanowire Network for High Capacity and High Power Lithium
Ion Battery Anodes, 2012.
J14.
Qian Li, Miao Tian, Wei Wang, Victor Bright, Yung-Cheng Lee, G.P. Peterson, and
Ronggui Yang, Flat Heat Pipes with
Patterned Nanowire Arrays as Wicking Structures,
2012.
J15. J. Ordonez-Miranda, J. J.
Alvarado-Gil and Ronggui Yang, Modulated Temperature Profile Predicted by the Phonon Boltzmann
Transport Equation, 2012
J16. David Makhija, Ronggui Yang, and Kurt Maute, A Comparative Study of velocity discretizations for the phonon Boltzmann transport equation using a stabilized finite element method, Submitted, August 2011.
J17.
Kurt Maute, Sebastian Kreissl, Ronggui
Yang, and David Makhija, Topology Optimization of
Heat Conduction in Nanocomposites, Structural and Multidisciplinary Optimization, 2012.
J18.
David Makhija, Georg Pingen, Ronggui
Yang, and Kurt Maute, A stabilized finite element
formulation for the hydrodynamic Boltzmann equation, 2012.
J19.
Dae Up Ahn, Y.C. Lee, and Victor M. Bright, Ronggui Yang, Self-Directed
Perpendicular/Parallel Orientation of Block Copolymer Nano-Cylinders
on Various Substrates.
e).
Patents (including Applications and Invention Disclosures)
1.
Gang Chen, Ronggui Yang, and Arvind
Narayanaswamy, Surface-Plasmon Enabled Nonequilibrium Thermoelectric Devices, US Provisional
60/567,987, May 4, 2004, Full US Patent Application 11/007,557, December 8,
2004. International Application WO 2005/112139 submitted in May 2005. US 7508110 issued on March 24, 2009.
2. Gang Chen, Xiaoyuan Chen, and Ronggui Yang, Multistage Thick Film Thermoelectric Devices, Disclosed to MIT Technology License Office in March 2005 (MIT Case No. 11653), Full US Patent Application, 11/668765, January 2007. International Application W) 2008/094903A2 submitted in August 2008.
3. Ronggui Yang, Weixue Tian, and Y.C. Lee, Photonic Crystal Fiber Based Capillary Pumped Loops Disclosed to University of Colorado Technology Transfer Office, March 2006, US Provisional No. 60/911,228, April 11, 2007.
4. Ronggui Yang, Yung-Cheng Lee, Chen Li, Jen-Hau Cheng, G.P. “Bud” Peterson, and Victor M. Bright, Flexible Thermal Ground Plane and Manufacturing Thereof, Disclosed to University of Colorado Technology Transfer Office, July 2007, US Provisional Patent No. 61/158,086, US Full Patent Application US20110017431, March 2010.
5. Victor M. Bright, Yung-Cheng Lee, Ronggui Yang, et al, Alternative Means to Fabricate a Flexible Thermal Ground Plane (supplement to disclosure #4), Disclosed to University of Colorado Technology Transfer Office, September 2008.
6. Ronggui Yang, Victor Bright, Zhifeng Ren, Joseph J. Brown, H. Jerry Qi, and Lucy Y. Pao, Programmable Thermal Point-Source Based Nanofabrication (PTBN), Disclosed to University of Colorado Technology Transfer Office, December 2007.
7. Ronggui Yang and Wei Wang, On-chip integration of silicon nanowire–enabled high efficiency solar cells with high capacity 3-dimensional lithium ion batteries and intrinsic thermal management, disclosed to University of Colorado Technology Transfer Office, April 2009.
8. Jen-Hau Cheng, and Ronggui Yang, A Universal Fabrication Process for Miniature Thermoelectric Devices, Disclosed to University of Colorado Technology Transfer Office, August 2007.
9. Ronggui Yang and Yung-Cheng Lee, Integration of Thermoelectric Devices, Thermal Ground Planes, and Innovative Heat Sinks for Energy Harvesting and Thermal Management, Disclosed to University of Colorado Technology Transfer Office, April 2009.
10. Ronggui Yang, Yung-Cheng Lee, and Steven M. George, Molecular-Layer-Deposition (MLD) Enabled Nano-Thermal Interface, Disclosed to University of Colorado Technology Transfer Office, August 2008.
11. Ronggui Yang and Wei Wang, Hybrid Micro/Nano-structures for Heat Transfer Enhancement and Manufacturing Thereof, to be disclosed to University of Colorado Technology Transfer Office, April 2009.
12. Ronggui Yang, Variable Thermal Resistors, to be disclosed to University of Colorado Technology Transfer Office, April 2009.
B). CONFERENCE PRESENATIONS AND PUBLICATIONS
a). Invited and Keynote Conference Presentations (after January 1, 2006)
2012
2011
1. Invited: Ronggui Yang, Enhancing Phase-Change Heat Transfer using Hybrid
Micro/Nano-Structured Surfaces. the 7th
US-Japan Joint Seminar on Nanoscale Thermal Transport,
December 11-14, 2011.
2. Invited: Kurt Maute, Sebastian Kreissl,
David Makhija, and Ronggui Yang, Topology
Optimization of Heat Conduction in Nano-Composites, 9th
World Congress on Structual and Multidisciplinary
Optimization, Shizuoka, Japan, June 13-17, 2011, presented by Kurt Maute.
3. Invited: Ronggui Yang, Exploring Quantum and Ballistic Thermoelectricity
for Energy Conversion and Sensor Applications, the 2011 US-Korea Workshop on Nanostructured
Materials, Nanoelectronics, and Nano-Biotechnoly,
Gyeongju, Korea, June 1-3, 2011.
4.
Invited: Mark Siemens, Qing Li, Margaret Murnane, Henry Kapteyn, Ronggui Yang, Probing
Nanoscale Thermal Transport using Extreme Ultraviolet
(EUV), SPIE Photonics West ’11
Conference, San Francisco, California, January 22-27, 2011, presented by
Mark Siemens.
2010
5. Invited: Ronggui Yang, Scaling Up Nanoscale Effects in Thermal Transport for Thermoelectricity and Thermal Management, InterAgency Power Group Meeting (Air Force, Army, Navy, Department of Energy, and NASA), Golden, CO, May 3-7, 2010.
2009
6. Invited: Ronggui Yang, Micro/Nano-enabled High Heat Flux Devices, DARPA/DSRC Physics of High Heat Flux Devices and their Applications Workshop, Arlington, VA, November 11-12, 2009
7. Invited: Mark Siemens, Qing Li, Margaret Murnane, Henry Kapteyn, Ronggui Yang, Erik Anderson, and Keith Nelson “Extreme Ultraviolet light in the lab: applications to surface science”, Optical Society of America Laser Science Annual Meeting, San Jose, CA, October 2009, Presented by Mark Siemens.
8. Invited: Ronggui Yang, “Energy Transport at Nanoscale: Modeling, Characterization and Applications.” Thin Air Philosophical Society (TAPS) Symposium on “Current Challenges in Mechanics and Materials” Boulder, CO, August 3-6, 2010.
9. Invited: Ronggui Yang, “Nano-Enabled Energy Harvesting and Storage Systems for Aerospace Environment Integration”, AFOSR Workshop on Energy Harvesting and Storage, Arlington VA, April 17, 2009.
10. Invited: Kurt Maute, Pilhwa Lee, Georg Pingen, and Ronggui Yang, Design Optimization of Transport Phenomena at Micro and Submicron Scale via Kinetic Theory Approaches, Conference on Multi-scale Modeling in Computational Mechanics, Rolduc, The Netherlands, March 11-13 2009, Presented by Kurt Maute.
2008
11. Invited Panelist: Ronggui Yang, Thermoelectric Nanocomposites: A Cheaper Nanotech Solution to Cleaner and Quieter Global Energy, EmTech 2008 organized by MIT Technology Review, September 23-25, MIT campus, MA.
12. Invited: Ronggui Yang, et al, Probing Nanoscale Thermal Transport using Extreme Ultraviolet (EUV) Light, 6th Japan- US Joint Seminar on Nanoscale Transport Phenomena - Science and Engineering,” July 13-16, 2008, Radisson Hotel, Boston, MA.
13. Invited Poster: Xiaochun Wang, Ronggui Yang, Yong Zhang, Jean-Pierre Fleurial, Andrew F. May, and G. Jeffrey Snyder, First Principles Study on Thermoelectric Properties of Lanthanum Chalcogenides, 6th Japan- US Joint Seminar on Nanoscale Transport Phenomena - Science and Engineering,” July 13-16, 2008, Radisson Hotel, Boston, MA.
14. Invited: Ronggui Yang, et al, Defect Decoration and Visualization for Atomic Layer Deposited Coatings, the 2nd Integration & Commercialization of Micro & Nanosystems International Conference & Exhibition, June 2008, Hongkong.
15. Invited Tutorial: Margaret M. Murnane, Jorge Rocca, John Miao, Ronggui Yang, Keith Nelson, Eric Anderson, Martin Aeschlimann, Carmen Menoni, Mario Marconi, and Henry C. Kapteyn, “Harnessing Attosecond Science for Visualizing the Nanoworld,” Paper QMF1 OSA Conference on Lasers and Electro-optics/ Quantum Electronics and Laser Science (CLEO/QELS), San Jose, CA, May 2008. Presented by Margaret Murnane.
16. Invited: Mark Siemens, Qing Li, Margaret Murnane, Henry Kapteyn, Ronggui Yang, Keith Nelson, Nanoscale Heat Transport Probed with Soft-X-Rays, Paper CWA6, OSA Conference on Lasers and Electro-Optics and the Quantum Electronics and Laser Science Conference (CLEO/QELS), May 2008, San Jose, CA, presented by Mark Siemens.
17. Invited: Mark Siemens, Qing Li, Ra’anan Tobey, Oren Cohen, Margaret Murnane, Henry Kapteyn, Ronggui Yang, and Keith Nelson, Ultrasensitive, Ultrafast Holographic Detection of Thermal Transients with Extreme Ultraviolet Radiation, The Gordon Research Conference on Photoacoustic and Photothermal Phenomena 2008, Los Angeles, Feb 8-14, 2008.
2007
18. Ronggui Yang, Introduction to Nanoscale and Ultrafast Thermal Sciences and Applications Lab, DARPA Young Faculty Award Workshop, November 2007, Arlington VA, (invited poster presentation).
19. Ronggui Yang, Surface-Plasmon Enabled High Efficiency Thermoelectric Devices, DARPA Young Faculty Award Workshop, November 2007, Arlington VA (invited seeding presentation).
20. Invited: Ronggui Yang, Thermoelectric Transport in Nanocomposites, Session on Thermoelectrics, 7th Pacific Rim Conference on Ceramic and Glass Technology, November 11-14, 2007, Shanghai, China
21. Invited Workshop Talk: Henry Kapteyn, Margaret Murnane , Keith Nelson, John Miao, Martin Aeschlimann, Ronggui Yang, “Ultrafast Probes of Materials using Table-top Coherent EUV Beams,” Division of Materials Sciences and Engineering Council Workshop on Ultrafast Materials Science, Santa Fe, NM, October 2007, Presented by Henry Kapteyn.
22. Research Update: Mark Siemens, Luis Avila, Xibin Zhou, Wen Li, Nick Wagner, Robynne Hooper, Qing Li, Jing Yin, Etienne Gagnon, Arvinder Sandhu, Ronggui Yang, Henry Kapteyn, Margaret Murnane, Erik Anderson, Keith Nelson, Martin Aeschlimann, “Ultrafast Probes of Molecules and Materials using Table-top Coherent EUV Beams,” 2007 Retreat of the NSF Engineering Research Center in Extreme Ultraviolet Science and Technology, Estes Park, CO, October 2007. Presented by Henry Kapteyn.
2006
23. Keynote: Ronggui Yang, Thermoelectric Transport in Nanocomposites, International Conference on Innovative Solutions for the Advancement of the Transport Industry, Oct 4-6, 2006.
24. Invited: Ronggui Yang, Thermoelectric Transport in Nanocomposites, Fourth International Workshop On Polymer Routes to Multifunctional Ceramics for Advanced Energy and Propulsion Applications, July 30-August 05, 2006, Boulder, CO.
25. Keynote Talk: Z. F. Ren, D. Z. Wang, B. Poudel, Yi Ma, Wenzhong Wang, Xiao Yan, Lili Chen, Bo Yu, Gang Chen, M. S. Dresselhaus, H. Lee, Q. Hao, R. G. Yang, M. Y. Tang, J. P. Fleurial, and P. Gogna, “Nanocomposite approach to high figure-of-merit thermoelectric materials”, ASME 1st Energy Nanotechnology International Conference (ENIC2006, Keynote), June 25 - 28, 2006, MIT, presented by Z.F. Ren.
26. Invited: Ronggui Yang, Gang Chen, M.S. Dresselhaus, J.P. Fleurial, and P. Gogna, Nanocomposite Engineering for High Efficiency Thermoelectric Materials, the 5th Joint Meeting of Overseas Chinese Physicists Worldwide - International Conference on Physics education and Frontier Physics (OCPA06), June 25-30, 2006, Taipei, Taiwan.
27. Research Update, Henry Kapteyn, Elliot Bernstein, Steve Leone, Dan Dessau, John Gland, Chris Greene, Tamar Seideman, Martin Aeschlimann, Ronggui Yang, Keith Nelson, Ivan Christov, Barry Walker, Tom Silva, and Rich Mirin, “Novel linear and nonlinear spectroscopies using small-scale EUV light sources,” NSF Engineering Research Center for Extreme Ultraviolet Science and Technology Annual Site Visit, May 2006. Presented by H. Kapteyn.
28. Invited Tutorial: M.S. Dresselhaus, G. Chen, J. Heremans, R.G. Yang, and G. Dresselhaus, Low Dimensional Thermoelectricity, Tutorial at 2006 APS March Meeting, March 12, 2006, Baltimore, MD, presented by M.S. Dresselhaus.
b). Contributed Conference Presentations and Papers (Denoted in the
list if there is a [Referred Paper] along
with the presentation.)
2012
2011
1.
Wei Wang, Aziz I. Abdulagatov,
Miao Tian, Steven M. George, and Ronggui
Yang, Three-Dimensional Ni Nanowire Network as
Electrodes for Lithium Ion Batteries, Proc. International Mechanical
Engineering Conference and Exhibition (IMECE2011), Denver, CO, November 11-17,
2011.
2.
Miao Tian, Wei Wang, and Ronggui Yang, Templated Fabrication of
3-Dimenisonal Nanowire Network Electrodes, Proc.
International Mechanical Engineering Conference and Exhibition (IMECE2011),
Denver, CO, November 11-17, 2011.
3.
Qian Li,
Wei Wang, Chris Oshmman, Benoit Latour,
Chen Li, Victor M. Bright, Yung-Cheng Lee and Ronggui Yang, Boiling Heat Transfer on
Hybrid Micro/Nano-Structured Surfaces, Proc. International Mechanical Engineering Conference and Exhibition
(IMECE2011), Denver, CO, November 11-17, 2011.
4.
[Extended
Abstract] Dan Li, Genshen Wu, Wei Wang,Yunda Wang, and Ronggui Yang, Monolithic Silicon Nanowire-Coated Microchannels for
Flow Boiling Heat Transfer, Proc. International
Mechanical Engineering Conference and Exhibition (IMECE2011), Denver, CO,
November 11-17, 2011.
5.
David Makhija,
Kurt Maute and Ronggui
Yang, Microfluidics using Boltzmann Equation with
Stabilized Finite Elements, Proc. International Mechanical Engineering
Conference and Exhibition (IMECE2011), Denver, CO, November 11-17, 2011.
6.
[Referred
Paper] Christopher Oshman, Ronggui Yang, Yung-Cheng Lee, and
Victor Bright, Electroformed High Aspect Ratio Copper Pillars for Application
in Flat Polymer-based Micro Heat Pipes,
Proc. International Mechanical Engineering Conference and Exhibition
(IMECE2011), Denver, CO, November 11-17, 2011.
7.
Xiaobo Li and Ronggui Yang,
Phonon Transmission across Interfaces of Lattice-Mismatched Dissimilar
Materials, Proc. International Mechanical Engineering Conference and Exhibition
(IMECE2011), Denver, CO, November 11-17, 2011.
8.
[Referred
Paper] Jun Liu, Mohamed Alhashme,
and Ronggui Yang, Thermal Transport
through Carbon Nanotubes Connected by Molecular
Linkers, Proc. International Mechanical Engineering Conference and Exhibition
(IMECE2011), Denver, CO, November 11-17, 2011.
9.
[Referred
Paper] Jun Zhou and Ronggui Yang, Thermoelectric Transport in Sb2Te3/Bi2Te3
Quantum Dot Nanocomposites, Proc. International
Mechanical Engineering Conference and Exhibition (IMECE2011), Denver, CO,
November 11-17, 2011.
10. Yuanyuan Wang, Jun Zhou and Ronggui
Yang, Thermoelectric Properties of Quasi-One-Dimensional Molecular Nanowires, Proc. International Mechanical Engineering
Conference and Exhibition (IMECE2011), Denver, CO, November 11-17, 2011.
11. [Referred Paper] J. Ordonez-Miranda, J. J.
Alvarado-Gil and Ronggui Yang, Effective Thermal Conductivity of Metal-Nonmetal Composites at the Dilute Limit,
the 16th
International Conference on Photoacoustic and Photothermal Phenomena, Merida, Yuctan,
Mexico, Nov. 27-Dec. 1, 2011.
12. Xiaobo Li, and Ronggui
Yang, Size
Effects on Phonon Transmission across Material Interfaces by Nonequilibrium Green’s Function Method, MRS
Spring Meeting, April
25-29, 2011, San Francisco, CA.
13. [Referred
Paper] Xianming Dai, Levey T.
Tran, Fanghao Yang, Bo Shi, Ronggui Yang, Y.C. Lee, and Chen Li, Characterization of Hybrid-Wicked Copper
Acetone Heat pipes, the
ASME/JSME 2011 8th Thermal Engineering Joint Conference, Honolulu,
Hawaii, march 13-17, 2011
2010
14. Jun
Zhou and Ronggui Yang, Thermoelectric
Transport in Quantum Dot Nanocomposites, MRS Fall
Meeting, November 30-Decmber 3, 2010, Boston, MA.
15. Miao
Tian, Wei Wang, and Ronggui Yang, Porous Anodic Alumina (PAA) Templated
Fabrication of Ni-Sn Nanowire
Arrays for Li-ion Batteries, MRS Fall Meeting, November
30-Decmber 3, 2010, Boston, MA.
16. Wei
Wang, Miao Tian, Kristopher W Holub,
and Ronggui Yang, Wafer-scale Silicon Nanowire Arrays with
Controllable Dimensions: Facile Fabrication and Optical Property
Characterization, MRS Fall Meeting, November 30-Decmber 3,
2010, Boston, MA.
17. [Referred
Paper] Sreekant Narumanchi, Suraj Thiagarajan, Kenneth Kelly, Charles King and Ronggui Yang, Heat Transfer Performance
of Enhanced Surfaces for Power Electronics Cooling Applications (IHTC14-23284),
International Heat Transfer Conference, Washington DC, August 8-13, 2010.
18. [Referred Paper] Jie Zhu, Dawei Tang, and Ronggui Yang, Frequency-Domain Pump-and-Probe Thermoreflectance Technique for Measuring Thermal Conductivity and Interface Thermal Conductance of Thin Films (IHTC14-22522), International Heat Transfer Conference, Washington DC, August 8-13, 2010.
19. [Referred Paper] Xiaobo Li, Jun
Liu, and Ronggui Yang, Tuning the
Thermal Conductivity using Mechanical Strains (IHTC14-23334),
International
Heat Transfer Conference,
20. [Referred Paper] Jen-Hau Cheng, John Schlager, Kris Bertness, Norman Sanford, Dragos Seghete, Steven George, Ronggui Yang and Y.C. Lee, “Thermal Management of Vertical Gallium Nitride Nanowire Array Devices: Cooling Design and Tip Temperature Measurement,” IEEE/MEMS Conference, Hongkong, January 25-29, 2010.
21. [Referred Paper] Chingyi Lin, Yadong Zhang, Aziz Abdulagatov, Ronggui Yang, Martin Dunn, Victor Bright, Steven George, Y.C. Lee, “ALD Hermetic Sealing for Polymer-Based Wafer Level Packaging of MEMS,” IEEE/MEMS Conference, Hongkong, January 25-29, 2010.
22. [Referred Paper] C. Oshman, B. Shi, C. Li, R.G. Yang, Y.C. Lee, and V.M. Bright, Fabrication and Testing of a Flat Polymer Micro Heat Pipe, 15th International Heat Pipe Conferencem Clemson, USA, April 25-30, 2010.
23. [Referred Paper] Yadong Zhang, Shih-Hui Jen, Ronggui Yang, Steven M. George, and Y. C. Lee, Real-Time Inspection of a Moisture Barrier Film Buried by a Protective Layer for Flexible Displays, the 2010 International Symposium, Seminar, and Exhibition, Seattle, WA, May 23-28, 2010.
24. Qing Li, Mark E. Siemens, Ronggui Yang, Margaret M. Murnane, Henry C. Kapteyn, Erik H. Anderson, Keith A. Nelson, "Observation of Quasi-Ballistic Heat Transport at Nano-Interfaces Using Coherent Soft X-Ray Beams", The Conference on Lasers and Electro-Optics (CLEO) and The International Quantum Electronics Conference (IQEC), May 16-21, 2010, San Jose, CA.
2009
25. Mark Siemens, Qing Li, Keith A. Nelson, Eric Anderson, Margaret Murnane, and Henry Kapteyn, Ronggui Yang, Quasi-ballistic thermal transport from nanoscale interfaces observed using ultrafast coherent soft X-ray beams, Poster Presentation for 2009 ASME Society-Wide Micro/Nano Technology Forum (ASME/IMECE 2009) Orlando, FL, November 13-19, 2009
26. Xiaobo Li, Jun Liu, and Ronggui Yang, Tuning the Thermal Conductivity using Mechanical Strains, Poster Presentation for 2009 ASME Society-Wide Micro/Nano Technology Forum (ASME/IMECE 2009) Orlando, FL, November 13-19, 2009
27. Qing Li , Mark Siemens , Ronggui Yang , Keith Nelson , Erik Anderson , Margaret Murnane , Henry Kapteyn, Quasi-ballistic thermal transport from a nanoscale hotspot observed using ultrafast coherent extreme ultraviolet beams, Fall 2009 Meeting of the Four Corners Section of the APS, Golden, CO, October 23-24, 2009. (Best Presentation Award)
28. Mark Siemens , Qing Li , Keith Nelson , Ronggui Yang , Erik Anderson , Margaret Murnane, Henry Kapteyn, High-Frequency Surface Acoustic Wave Propagation in Nanostructures Characterized by Coherent Extreme Ultraviolet Beams, Fall 2009 Meeting of the Four Corners Section of the APS, Golden, CO, October 23-24, 2009.
29. Mark Siemens, Qing Li, Margaret Murnane,
Henry Kapteyn, Ronggui
Yang, and Keith Nelson,Time-resolved measurement of quasi-ballistic heat
transport across nanoscale interfaces, 2009 Summer Heat Transfer Conference, July 19-23, 2009,
30. Pilhwa Lee, Kurt Maute,
and Ronggui Yang, “An extended
finite element method (XFEM) for nano-scale heat transfer,”
Proceedings of 2009 NSF Engineering Research and
Innovation Conference,
31.
Pilhwa Lee, Kurt Maute,
and Ronggui Yang, An extended finite
element method (XFEM) based topology optimization for nano-scale
heat transfer, the U.S. National Congress on Computational Mechanics
(USNCCM X), July 16-19, 2009,
32. Xiaobo Li and Ronggui Yang, Stain Effects on the Thermal Conductivity of Nanostructures, 17th Symposium on Thermophysical Properties, June 21-26, 2009, Boulder, CO
33. Mark Siemens, Qing Li, Margaret Murnane,
Henry Kapteyn, Ronggui
Yang, Erik Anderson, and Keith Nelson, Time-Resolved Quasi-Ballistic Heat
Transport at Nano-Interfaces, 17th
Symposium on Thermophysical Properties, June 21-26,
2009,
34. Pilhwa Lee, Kurt Maute,
and Ronggui Yang, An extended finite
element method (XFEM) based topology optimization for nano-scale
heat transfer, 17th Symposium on Thermophysical Properties, June 21-26, 2009,
35. Mark Siemens, Qing Li, Margaret Murnane,
Henry Kapteyn, Ronggui
Yang, Erik Anderson, and Keith Nelson, EUV
Detection of High-Frequency Surface Acoustic Waves, The Conference on Lasers
and Electro-Optics (CLEO) and The International Quantum Electronics Conference
(IQEC), May 31-June 5, 2009, Baltimore, MD
36. [Referred Paper] C. Oshman, B. Shi, C. Li, R.G. Yang, Y.C. Lee, and V.M. Bright, Fabrication and Testing of a Flat Polymer Micro Heat Pipe, The 15th International Conference on Solid-State Sensors, Actuators and Microsystems (Transducers 2009), June 21 - 25, 2009, Denver, CO.
37. Yadong Zhang, Yu-Zhong Zhang, David C. Miller, Jacob A. Bertrand, Shih-Hui Jen, Ronggui Yang, Martin L. Dunn, Steven M. George, and Y. C. Lee, Defect Inspection of ALD/MLD-Based Barrier Coatings, IMAPS/ACerS 5th International Conference and Exhibition on Ceramic Interconnect and Ceramic Microsystems Technologies (CICMT 2009), April 20-23, 2009, Denver, CO.
38. Ching-Yi Lin, Ronggui Yang, Y. C. Lee, Aziz Abdulagatov, and Steven M. George, Flexible Thermal Ground Plane Enabled by ALD/MLD-Based Barrier Coatings, IMAPS/ACerS 5th International Conference and Exhibition on Ceramic Interconnect and Ceramic Microsystems Technologies (CICMT 2009), April 20-23, 2009, Denver, CO.
39. David C. Miller, Ross R. Foster, Yadong Zhang, Shih-Hui Jen, Jacob A. Bertrand, Zhixing Lu, Dragos Seghete, Jennifer L. O’Patchen, Ronggui Yang, Yung-Cheng Lee, Steven M. George, and Martin L. Dunn, Mechanical Robustness of ALD/MLD-Based Barrier Coatings, IMAPS/ACerS 5th International Conference and Exhibition on Ceramic Interconnect and Ceramic Microsystems Technologies (CICMT 2009), April 20-23, 2009, Denver, CO.
40. Bo Shi, Christopher Oshman, Aziz Abdulagatov, Myongjai Lee, Virginia Yong, Dae Up Ahn, Ching-Yi Lin, Wei Wang, Jen-Hau Cheng, Chen Li, Ronggui Yang, Victor Bright, Steven George, G.P. “Bud” Peterson, Y.C. Lee, Development of Micro/Nano-Enabled Flexible Thermal Ground Plane, Workshop on MEMS & Associated Microsystems, International Conference and Exhibition on Device Packaging, March 9 - 12, 2009, Scottsdale/Fountain Hills, Arizona
2008
41. David C. Miller, Ross R. Foster, Yadong Zhang, Shih-Hui Jen, Jacob A. Bertrand, Zhixing Lu, Dragos Seghete, Jennifer L. O’Patchen, Ronggui Yang, Yung-Cheng Lee, Steven M. George, and Martin L. Dunn, “Mechanical Robustness of Atomic Layer Deposited and Molecular Layer Deposited Coatings for Microsystems and Flexible Electronics Applications,” Symposium I: Reliability and Properties of Electronic Devices on Flexible Substrates, Material Research Society (MRS) Symposium, Fall 2008, Boston, MA
42. [Referred Paper] Nicholas
Allec, Zyad Hassan, Li
Shang, Robert P. Dick and Ronggui Yang,
“ThermalScope: Multi-scale Thermal Analysis for
Nanometer-scale Integrated Circuits,” International Conference on
Computer-Aided Design (ICCAD),
43. Mark Siemens, Qing Li, Margaret Murnane, Henry Kapteyn, Ronggui Yang, and Keith Nelson, “Probing Quasi-Ballistic Heat Transport using Coherent EUV Beams,” Directed Energy Professional Society Ultrashort Pulse Laser Workshop, Boulder, CO, September 2008.
44. [Referred Paper] Liang-Chun Liu, Mei-Jiau Huang, and Ronggui Yang, Curvature Effect on the Thermal Conductivity of Nanowires, 2008 Summer Heat Transfer Conference, August 10-14, 2008 Jacksonville, FL.
45. Mark Siemens, Qing Li, Margaret Murnane,
Henry Kapteyn, Ronggui
Yang, and Keith Nelson, Nanoscale Heat Transport
Probed with Soft X-Rays, XVI
International Conference on Ultrafast Phenomena, June 9-13 2008,
46. Anton
Evgrafov, Kurt Maute,
Ronggui Yang
and Martin Dunn,
“Topology Optimization for Nano-Scale Heat
Transfer,” 8th.
World Congress on Computational Mechanics (WCCM8) and the 5th. European Congress on Computational
Methods in Applied Sciences and Engineering (ECCOMAS 2008), 30 June - 4
July 2008, the
47.
[Referred
Paper] Yadong Zhang, Yu-Zhong
Zhang, David C. Miller, Jacob A. Bertrand, Ronggui
Yang, Martin L. Dunn, Steven M. George and Y. C. Lee, Fluorescent Tag-Based Inspection of Barrier Coatings for OLEDs
and Polymer Packages, NSTI Nanotech 2008,
48. [Referred Paper] Zhang, David C. Miller, Jacob A. Bertrand, Yu-Zhong Zhang, Ronggui Yang, Martin L. Dunn, Steven M. George and Y. C. Lee, Fluorescent Tag-Based Inspection of Barrier Coatings for OLEDs and Polymer Packages, Society for Information Display, 2008 International Symposium, Seminar and Exhibition May 18-23, 2008, Los Angeles, CA .
49. Kurt Maute, Anton Evgrafov, Ronggui Yang, Martin Dunn, Topology Optimization of Nano- and Submicro-scale Heat Transfer, Proceedings of 2008 NSF Engineering Research and Innovation Conference, January 2008, Knoxville, TN (un-referred paper).
50. [Referred Paper] Ronggui Yang, Jen-Hau Cheng, Weixue Tian, Ming-Shan
Jeng, and Gang Chen, Thermal Conductivity of Nanocomposites, ASME Micro/Nanoscale Heat Transfer International Conference (MNHT08),
January 2008,
2007
51. Mark E. Siemens, Qing Li, Oren Cohen, Henry Kapteyn, Margaret Murnane, and Ronggui Yang, "Probing Quasi-ballistic heat transport using coherent EUV beams", Directed Energy Professional Society 2007, Ultrashort Pulse Laser Workshop, October 2007.
52. Qing Li, Mark E. Siemens, Oren Cohen, Henry Kapteyn, Margaret Murnane, Ronggui Yang, Probing Quasi-Ballistic Phonon Thermal Transport using Extreme Ultraviolet (EUV), Ultrafast Optics 2007, High Field Short Wavelength, September 2007.
53.
[Referred
Paper] Weixue Tian and Ronggui Yang,
Thermal Conductivity of Randomly Stacked Nanoparticle
Composites, ASME-JSME Heat Transfer Conferences,
54. Ronggui Yang, Thermal Conductivity Modeling and Characterization of Nanocomposites and Nano-ceramics, AFOSR focused workshop on Ultra-High Temperature Ceramic (UHTC) Materials Menlo Park, CA, July 23-25, 2007.
55. Y. Zhang, R. Yang, S.M. George and Y.C. Lee, Atomic Layer Deposition for Hermetic Polymer Packages, (abstract #1637), NSTI Nanotechnology Conference and Trade Show, May 20-24, 2007, Santa Clara, California (Un-Referred Paper)
56. Ronggui Yang, G.P. “Bud” Peterson, Chen Li, Victor Bright, Y.C. Lee, Martin Dunn, Steven M. George, Kurt Maute, Margaret M. Murnane, and Henry Kapteyn, Thermal Challenges and Innovations in Emerging Micro/Nano Systems, DARPA Microsystems Technology Symposium, March 3-5, 2007, San Jose, CA.
57. Weixue Tian and Ronggui Yang, Monte Carlo simulation of thermal conductivity in randomly distributed nanowire composites (A43.00009), American Physical Society March Meeting, Denver CO, 2007.
58.
Ming Tang , Hohyun Lee , Asegun Henry , Ronggui Yang , Dezhi
Wang , Jean-Pierre Fleurial , Pawan
Gogna , Gang Chen , Zhifeng
Ren , Mildred Dresselhaus,
Thermoelectric properties of Si-Ge nanoparticle composites (N43.00009), American Physical
Society March Meeting, Denver CO, 2007.
2006
59.
[Referred
Paper] Ming Y. Tang, Mildred S Dresselhaus,
Gang Chen, and Ronggui Yang,
Thermoelectric Modeling of Si Nanoparticle Composites,
December 1, 2006 Fall MRS Meeting at
60. Ronggui Yang, “Some Ideas on Variable Thermal Resistors”, DARPA Workshop on Variable Thermal Resistors, Boulder, CO, October 2006, (invited 45 minutes individual presentation to Program Manager Dr. Tom Kenny).
61.
Ronggui Yang, Thermoelectric Transport in Nanocomposites,
Multifunctional NANOcomposites 2006 International
Conference, ASME Nano-Institute,
62. Gang Chen, X.Y. Chen, Z. Chen, L. Hu, A. Narayanaswamy, and R.G. Yang, Thermally-Excited Nonequilibrium between Electrons and Phonons for Energy Conversion, Nanoscale Energy Conversion and Information Processing Devices, Nice, France, September 24-26, 2006, (invited oral presentation).
63. Ronggui
Yang, Thermoelectric Transport in Nanocomposites,
16th Symposium on Thermophysical
Properties, Boulder, CO, July 30-Aug. 04, 2006.
64.
Ronggui Yang, and Gang Chen, Thermoelectric Transport in Nanocomposites,
SAE 2006 World Congress,
65.
G. Chen, R. Yang, M.S. Dresselhaus, et al, The Nanocomposite Approach to Enhanced
Thermoelectric Performance (B35.00003), 2006 APS March Meeting, Baltimore, MD,
March 13–17, 2006.
Before
2005
66.
[Referred
Paper] M.S. Dresselhaus, G.
Chen, M.Y. Tang, Ronggui Yang, D.Z.
Wang, Z.F. Ren, J.P. Fleurial,
and P. Gogna, New Directions for Nanoscale
Thermoelectric Materials Research (invited),
Proc. MRS Fall Meeting, paper # F1.1,
67. [Referred Paper] Ming Y. Tang, M. S. Dresselhaus, Ronggui Yang, and Gang Chen, Thermoelectric Modeling of Si-Si1-xGex Ordered Nanowire Composites, Proc. MRS Fall Meeting, Boston, MA, 2005.
68.
G. Chen, R.G. Yang, et al, Design, Modeling, and Synthesis of Nanocomposites for Solid-State Energy Conversion, SPIE
Optic East - Nanofabrication: Technologies, Devices, and Applications,
69. Ronggui Yang, Xiaoyuan Chen, Aaron Schmidt, and Gang Chen, Pump-Probe Experimental Study of Phonon Reflectivity at an Interface and Phonon Relaxation Time (Nano2005-87064), ASME 4th Integrated Nanosystems – Design, Synthesis, & Applications, UC-Berkeley, September 14-16, 2005, (extended abstract).
70. Ronggui Yang, and Gang Chen, Non-local Formulation of Rarefied Poiseuille Flow (Nano2005-87072), ASME 4th Integrated Nanosystems – Design, Synthesis, & Applications, UC-Berkeley, September 14-16, 2005, (extended abstract).
71. [Referred Paper] G. Chen, R.G. Yang, et al, Engineering Phonon and Electron Transport in Nanocomposites for Solid-State Energy Conversion (invited), Proceedings of the 5th International Workshop on Structural Health Monitoring, Ed. Fu-Kuo Chang, pp. 1443-1450, Stanford, September 12-14, 2005.
72. G. Chen, A. Narayanaswamy, Z. Chen, R.G. Yang, and L. Hu, Nanoscale Thermal Radiation: Fundamental Issues and New Opportunities, US-Japan Seminar on Nanoscale Heat Transfer, July 2005, (invited oral presentation)
73.
[Referred Paper] Ronggui Yang, Gang Chen and Mildred S. Dresselhaus, Thermal Conductivity of Core-Shell
Nanostructures: from Nanowires to Nanocomposites
(HT 2005-72198), ASME Heat Transfer Conference,
74. [Referred Paper] Ming-Shan Jeng, Ronggui Yang, and Gang Chen, Monte Carlo Simulation of Phonon Transport and Thermal Conductivity in Nanocomposites (IPACK 2005-73494), The ASME/Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems (InterPACK’05), San Francisco, July 2005.
75. [Referred Paper] Ming-Shan Jeng, Ronggui Yang, and Gang Chen, Monte Carlo Simulation of Thermoelectric Properties in Nanocomposites, the 24th International Conference on Thermoelectrics (IEEE), Clemson University, Clemson SC, June 19-23, 2005.
76. [Referred Paper] Hohyun Lee, Dezhi Wang, Wenzhong Wang, Zhifeng Ren, B. Klotz, Ming Y. Tang, Ronggui Yang, Pawan Gogna, Jean-Pierre Fleuiral, Mildred S. Dresselhaus, and Gang Chen, Thermoelectric Properties of Si/Ge Nano-composite, the 24th International Conference on Thermoelectrics (IEEE), Clemson University, Clemson SC, June 19-23, 2005.
77. K. Miyazaki, H. Tsukamoto, R.G. Yang, and G. Chen, Thermal Conductivity of Nanostructured Material, Fifth International Conference on Enhanced, Compact and Ultra-Compact Heat Exchangers: Science, Engineering and Technology, Whistler, BC, Canada, Sep 11-15, 2005.
78.
Gang Chen, Ronggui Yang, Arvind Narayanaswamy,
and Xiaoyuan Chen,
79. [Referred
Paper] Ronggui
Yang and Gang Chen, Thermal Conductivity Prediction
of Periodic Nanocomposites using Phonon Boltzman Equation (HT-FED2004-5646),
Proc. 2004
ASME Heat Transfer/Fluids Engineering Summer Conference (HTFED2004), pp. 449-456, Charlotte, North Carolina, July
11-15, 2004.
80. [Referred Paper] Ronggui Yang, Arvind Narayanaswamy and Gang Chen, Nonequilibrium Electron-Phonon Thermoelectric Devices using Surface Plasmon, Proc. the Sixth International Symposium of Heat Transfer (ISHT6), Beijing, China, June 15-19, 2004.
81. [Referred Paper] Ronggui Yang and Gang Chen, Recent Developments in Nanostructured Thermoelectric Materials and Devices, Panel on "Challenges in Chip/Processor Level Thermal Engineering" at 9th IEEE/ASME Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITHERM2004), pp.731-732, Las Vegas, NV, June 1-4, 2004.
82. [Referred Paper] Ronggui Yang and Gang Chen, Theoretical Thermal Conductivity of Nano-composites, in Thermoelectric Materials 2003, Research and Applications, vol 793, pp. 121-126, eds. G. S. Nolas and J. Yang and T. P. Hogan and D. C. Johnson. From the Materials Research Society Fall 2003 Meeting, Symposium S, Paper S5.2.
83. [Referred Paper] G. Chen, C. Dames, T. Harris, D. Borca-Tasiuc, R.G. Yang, B. Yang, W.L. Liu, D. Song, and M. Takashiri, Thermal Conductivity Reduction Mechanisms in Superlattices (invited), Proc. International Thermoelectric Conference 2003 (IEEE), La Grande Motte, France, August 2003.
84.
[Referred
Paper] Jianping Fu, Ronggui Yang, Gang
Chen, G. Jeffrey Snyder, and Jean-Pierre Fleurial,
Integrated Electroplated Heat Spreaders for High Power Quantum Well Lasers
(TED-AJ03-332), Proc. 7th ASME/JSME Joint Thermal Engineering
Conference (AJTE 2003),
85.
[Referred
Paper] Gang Chen and Ronggui Yang, Nano-to-Macroscale
Transport Modeling through Approximations (IMECE2002-32120, invited), Proc. International
Mechanical Engineering Conference and Exhibition (IMECE2002), pp. 61-68,
86.
[Referred Paper] Ronggui Yang, Gang Chen, and Yuan Taur, Ballistic-Diffusive Equations for Multidimensional Nanoscale Heat Conduction, Proc. International Heat
Transfer Conference (IHTC 2002),
87. [Referred Paper] R.G. Yang and G. Chen, Energy Conversion and Transport Near a Solid-Solid Interface, International Thermoelectric Conference 2002 (IEEE), Long Beach, CA, August 2002.
88.
Ronggui Yang, Diana Borca-Tasuica
and Gang Chen, Heat Conduction and Energy Conversion in Nanoscale,
Proc. The 20th Symposium on Energy Engineering Sciences,
89. [Referred Paper] R.G. Yang, G. Chen, G.J. Snyder and J.-P. Fleurial, Design of two-stage Thick film Thermoelectric Micro Coolers for Mid-IR Lasers Thermal Management, Proc. 8th IEEE/ASME Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITHERM 2002), pp. 323-329, San Diego, CA, May 2002.
90. [Referred Paper] Ronggui Yang and Gang Chen, Two Dimensional Nanoscale Heat Conduction Using Ballistic-Diffusive Equations, Proc. International Mechanical Engineering Conference and Exhibition, Vol. 1: pp.363-366, New York, Nov. 2001.
91. [Referred Paper] R.G. Yang, G. Chen, G.J. Snyder and J.-P. Fleurial, Geometric Effects On the Transient Cooling of Thermoelectric Coolers, Proc. Material Research Society Fall 2001 Meeting, pp. 281-286, Boston, MA, Nov. 2001.
92. [Referred Paper] A. Ravi Kumar, R.G. Yang, G. Chen, and J. P. Fleurial, Transient Thermoelectric Cooling for Thin Film Devices, Proc. IEEE International Symposium on Circuits and Systems, v 4, 2001, p Z1141-Z1146 (MRS Spring 2000 meeting).
93.
[Referred
Paper] Ronggui
Yang, Shuye Lei and Jianhua Du, Heat and Mass transfer in Low Moisture-content
Saturated Porous Media During Sudden Heating: I. Fundamentals, Proceedings of 5th
ASME/JSME Joint Thermal Engineering Conference (AJTE1999),
94.
[Referred
Paper] Ronggui
Yang, Jianhua Du and Shuye Lei, Heat and Mass Transfer in Low Moisture- content
Saturated Porous Media during Sudden Heating: II. Numerical Simulation,
Proceedings of 5th ASME/JSME Joint Thermal Engineering Conference
(AJTE 1999),
95. [Referred Paper] Shuye Lei, Chunmei Xia, Ronggui Yang and Yong Cao, Numerical Simulation and Analysis of Process in Unsaturated Porous media for Measuring Thermal Conductivity with Transient Heat Probe, 5th Asian Thermal Property Conference, Sep. 1998, Seoul Korea.
96. [Referred Paper] Ronggui Yang, Jianhua Du and Shuye Lei, Seepage Model on Simultaneous Transport of Heat-Water-Air-Solute in Porous Media, 12th Hydrodynamics Conference (in Chinese), August 1998.
97. [Referred Paper] Shuye Lei, Ronggui Yang and Jianhua Du, Transport Theory in Unsaturated Porous Media, Annual Heat and Mass Transfer Conference of Chinese Engineering Thermophysics Society (in Chinese), 1998.
98. [Referred Paper] Ronggui Yang, Jianhua Du and Shuye Lei, Numerical Simulation of the Transport Phenomena in Porous Media, Annual Heat and Transfer Conference of Chinese Engineering Thermophysics Society (in Chinese), 1998.
99. [Referred Paper] Ronggui Yang, Jianhua Du and Shuye Lei, Solute Effect on Heat and Moisture Transfer in Unsaturated Porous Media, Annual Heat and Transfer Conference of Chinese Engineering Thermophysics Society (in Chinese), 1998.
100. [Referred Paper] Shuye Lei, Guanyu Zheng, Buxuan Wang, Ronggui Yang and Chunmei Xia, Numerical Simulation of the Transport Phenomena Due to Sudden Heating in Porous Media, ASME 31st National Heat Transfer Conference (NHTC 1997), Baltimore, Maryland, August 1997.
101. [Referred Paper] Shuye Lei, Chunmei Xia, Ronggui Yang and Yong Cao, Analysis of Unsaturated Porous Media Thermal Conductivity Measurement, Annual Heat and Transfer Conference of Chinese Engineering Thermophysics Society (in Chinese), Oct. 1997.
C). INVITED SEMINARS
1. June 21, Nanoscale Heat Conduction, Tsinghua University, Beijing, China.
2. June 21, Manufacturable Micro/Nanotechnologies for Thermal Management and Energy Storage, Peking Univeristy, Beijing, China.
3. June 20, Nanoscale Heat Conduction, Institute of Mechanics, Chinese Academy of Science, Beijing, China.
4. June 20, Nanoscale Heat Transfer, Beijing Jiaotong University, Beijing, China.
5. June 17, Nanoscale Heat Transfer, Institute of Engineering Thermophysics, Chinese Academy of Scince, Beijing, China.
6. June 16, Nanoscale Heat Transfer, University of Science and Technology in Beijing, Beijing, China.
7. June 15, Thermal and Thermoelectric Transport in Nanocomosites, Nanjing University, Nanjing, China.
8. June 14, Nanoscale Heat Conduction, Southeast University, Nanjing, China.
9. June 13, Nanoscale Heat Transfer, Nanjing University of Science and Technology, Nanjing, China.
10. March 23, 2011, Thermal Science and Engineering for Thermoelectric Energy Conversion, Department of Mechanical, Aerospace, and Nuclear Engineering, Rensselaer Polytech Institute, NY.
11. February 16, 2011, Thermal Science and Engineering for Thermoelectric Energy Conversion, Department of Mechanical Engineering, University of California, Berkeley, CA.
12. February 8, 2011, Thermal Science and Engineering for Thermoelectric Energy Conversion, Department of Mechanical Science and Engineering, University of Illinois, Urbana-Champaign, IL.
13. December 3, 2010, Scalable Thermal Management Technologies: from Atoms to Systems, Department of Mechanical Engineering, MIT, Cambridge, MA.
14. November 18, 2010, Scalable Thermal Management Technologies: from Atoms to Systems, Department of Mechanical Engineering, University of Colorado, Boulder, CO.
15. March 24, 2010, Nano-Enabled Energy Conversion and Thermal Management: from Fundamental Sciences to Manufacturable Systems, Department of Mechanical and Aerospace Engineering, Rutgers University, New Brunswick, NJ.
16. March 22, 2010, Nano-structured Thermal Interfaces for Sustainable Energy technologies, Department of Mechanical and Nuclear Engineering, Pennsylvania State University, University Park, PA.
17. February 25, 2010, Nano-structured Thermal Interfaces for Sustainable Energy technologies, Mechanical Engineering, California Institute of Technology, Pasadena, CA.
18. February 24, 2010, Nano-structured Thermal Interfaces for Sustainable Energy technologies, Department of Mechanical Engineering and Materials Sciences, Duke University, NC.
19. November 23, 2009, Nano-Enabled Energy Conversion and Thermal Management: from Fundamental Sciences to Manufacturable Systems, Department of Mechanical and Aerospace Engineering, Case Western Reserve University, Cleveland OH.
20. August 27, 2009, Nanoscale Thermal Transport, Department of Mechanical Engineering, University of Colorado, Boulder, CO.
21. June 2, 2009, Challenges and Opportunities in Nanoscale Heat Transfer, Department of Physics, Xiamen University.
22. June 1, 2009, Challenges and Opportunities in Nanoscale Heat Transfer, Department of Electrical and Information Engineering, Putian University.
23. June 26, 2008, Nanoscale Heat Transfer: Challenges and Opportunities, National Renewable Energy Lab, Golden, CO [Host: Dr. Sreekant Narumanchi and Dr. Kenneth Kelly].
24. June 4, 2008, Challenges and Opportunities in Nanoscale Heat Transfer, Department of Mechanical Engineering, Hongkong University of Science and Technology [Host: Dr. Zhigang Li].
25. March 28, 2008, Challenges and Opportunities in Nanoscale Heat Transfer, Department of Mechanical Engineering, University of Toledo [Host: Dr. Calvin H. Li].
26. May 2007, Nanotechnological Innovations in Thermoelectric Energy Conversion and Thermal Management, Beijing University, Tsinghua University, Zhongshan University, sponsored by National Natural Science Foundation of China [Host: Prof. Xiaofeng Peng at Tsinghua University].
27. March 22, 2007, Nanotechnological Innovations in Thermoelectric Energy Conversion and Thermal Management, CU Building Systems Seminar Series, University of Colorado at Boulder.
28. May 17, 2006, Nanoscale and Ultrafast Thermal Sciences and Applications, National Renewable Energy Lab (Golden, CO) [Host: Dr. Mark Hanna and Dr. Chuck Kutscher]
29. April 12, 2006, Nanoscale Heat Transfer and Energy Conversion, CU Energy and Environment Seminar Series, University of Colorado at Boulder [Host: Drs. Shelly L. Miller and Mike Hannigan].
30. March 16, 2006, Nanoscale and Ultrafast Thermal Sciences and Applications, Department of Chemistry, University of Colorado at Boulder [host: Dr. Steven M. George].
31. Feb. 13, 2006, Nanoscale and Ultrafast Thermal Sciences and Applications, Materials Reliability Division, National Institute of Standards and Technology (NIST-Boulder) [Host: Dr. Wood Johnson].
32. Feb. 03, 2006, Nanoscale and Ultrafast Thermal Sciences and Applications, JILA/Physics Department, University of Colorado at Boulder [host: Drs. Margaret M. Murnane and Henry Kapteyn].
33. Dec. 02, 2005, Nanoscale Heat Transfer with Applications in Nanoelectronics, Department of Electrical and Computer Engineering, Tufts University.
34. May 13, 2005, Nanoscale Heat Transfer with Applications in Nanoelectronics and Thermoelectrics, Intel Corporation – Assembly Technology Development, Arizona
35. April 4, 2005, Nanoscale Heat Transfer with Applications in Nanoelectronics and Thermoelectrics, University of Notre Dame.
36. March 31, 2005, Nanoscale Heat Transfer with Applications in Nanoelectronics and Thermoelectrics, University of Colorado – Boulder.
37. March 22, 2005, Nanoscale Heat Transfer with Applications in Nanoelectronics and Thermoelectrics, University of Houston.
38. March 17, 2005, Nanoscale Heat Transfer with Applications in Nanoelectronics and Thermoelectrics, University of Illinois – Urbana Champaign.
39. March 01, 2005, Nanoscale Heat Transfer with Applications in Nanoelectronics and Thermoelectrics, University of Wisconsin.
40. Feb. 24, 2005, Nanoscale Heat Transfer with Applications in Nanoelectronics and Thermoelectrics, the City College of New York.
41. Feb. 17, 2005, Nanoscale Heat Transfer with Applications in Nanoelectronics and Thermoelectrics, SUNY-Stony Brook.
42. Dec. 20, 2004, Nanoscale Heat Transfer with Applications in Nanoelectronics and Thermoelectrics, Columbia University.