Nano–enabled Energy Conversion, Storage, and Thermal Management (NEXT) Group

University of Colorado at Boulder

 

Director: Dr. Ronggui Yang, Assistant Professor of Mechanical Engineering and Sanders Faculty Fellow in Engineering

Office: ECME 136, Engineering Center

Tel: 303-735-1003 (O),   Fax: 303-492-3498

 

 

People    Research    Publications    Facilities    Open Positions    News

 

 

PUBLICATIONS AND PRESENTATIONS

(PDF links are given here for academic use only. Preprints could be requested by sending emails to Professor Ronggui Yang [Ronggui.Yang@Colorado.Edu] with full citation information of the paper requested)

 

 

A). BOOKS AND JOURNAL PUBLICATIONS

 

a). Ph.D Dissertation

Ronggui Yang, Nanoscale Heat Conduction with Applications in Nanoelectronics and Thermoelectrics, MIT, Defended on November 18, 2005.

 

b). Book Chapters

1.      G. Chen, D. Borca-Tascuic and R.G. Yang, “Nanoscale Heat Transfer,” in “Encyclopedia of Nanoscience and Nanotechnology”, eds. H.S. Nalwa, Vol. 7, pp. 429-459, American Scientific Publishers, 2004. PDF

2.      Suraj J. Thiagarajan, Wei Wang, and Ronggui Yang, “Nanocomposites as High Efficiency Thermoelectric Materials,” in Annual Review of Nano Research, Volume 3, ed. G.Z. Cao, Q.F. Zhang, and C.J. Brinker, World Scientific Publisher Co., Singapore, p. 447-492, 2009.PDF

3.      Pilhwa Lee, Kurt Maute and Ronggui Yang, ‘An Extended Finite Element Method for the Analysis of Submicron Heat Transfer Phenomena,” book chapter in "Multiscale Methods in Computational Mechanics" in the Springer series “Lecture Notes in Applied and Computational Mechanics “

4.      Ronggui Yang, Jie Zhu and Xiaobo Li, “Nanoscale Heat Transfer” (Chapter 19), The Encyclopedia of Life Support Systems (EOLSS) Topics of Heat & Mass Transfer (6.170), edited by W.Q. Tao, to be published by UNESCO in March 2010.

 

c). Editorial

·        G. Chen G, R. Yang, & S. Volz, “Editorial: A special issue on nanoscale heat transfer,” Journal of Computational and Theoretical Nanoscience, Vol. 5, n 2, pages: I-II, Feb 2008, PDF.

 

d). Patents (Applications and Invention Disclosures)

1.      Gang Chen, Ronggui Yang, and Arvind Narayanaswamy, Surface-Plasmon Enabled Nonequilibrium Thermoelectric Devices, US Provisional 60/567,987, May 4, 2004, Full US Patent Application 11/007,557, December 8, 2004. International Application WO 2005/112139 submitted in May 2005. US 7508110 issued on March 24, 2009.

2.      Gang Chen, Xiaoyuan Chen, and Ronggui Yang, Multistage Thick Film Thermoelectric Devices, Disclosed to MIT Technology License Office in March 2005 (MIT Case No. 11653), Full US Patent Application, 11/668765, January 2007. International Application W) 2008/094903A2 submitted in August 2008.

3.      Ronggui Yang, Weixue Tian, and Y.C. Lee, Photonic Crystal Fiber Based Capillary Pumped Loops Disclosed to University of Colorado Technology Transfer Office, March 2006, US Provisional No. 60/911,228, April 11, 2007.

4.      Ronggui Yang, Yung-Cheng Lee, Chen Li, Jen-Hau Cheng, G.P. “Bud” Peterson, and Victor M. Bright, Flexible Thermal Ground Plane and Manufacturing Thereof, Disclosed to University of Colorado Technology Transfer Office, July 2007, US Provisional Patent No. 61/158,086.

5.      Victor M. Bright, Yung-Cheng Lee, Ronggui Yang, et al, Alternative Means to Fabricate a Flexible Thermal Ground Plane (supplement to disclosure #4), Disclosed to University of Colorado Technology Transfer Office, September 2008.

6.      Ronggui Yang, Victor Bright, Zhifeng Ren, Joseph J. Brown, H. Jerry Qi, and Lucy Y. Pao, Programmable Thermal Point-Source Based Nanofabrication (PTBN), Disclosed to University of Colorado Technology Transfer Office, December 2007.

7.      Ronggui Yang and Wei Wang, On-chip integration of silicon nanowire–enabled high efficiency solar cells with high capacity 3-dimensional lithium ion batteries and intrinsic thermal management, disclosed to University of Colorado Technology Transfer Office, April 2009.

8.      Jen-Hau Cheng, and Ronggui Yang, A Universal Fabrication Process for Miniature Thermoelectric Devices, Disclosed to University of Colorado Technology Transfer Office, August 2007.

9.      Ronggui Yang and Yung-Cheng Lee, Integration of Thermoelectric Devices, Thermal Ground Planes, and Innovative Heat Sinks for Energy Harvesting and Thermal Management, Disclosed to University of Colorado Technology Transfer Office, April 2009.

10.  Ronggui Yang, Yung-Cheng Lee, and Steven M. George, Molecular-Layer-Deposition (MLD) Enabled Nano-Thermal Interface, Disclosed to University of Colorado Technology Transfer Office, August 2008.

11.  Ronggui Yang and Wei Wang, Hybrid Micro/Nano-structures for Heat Transfer Enhancement and Manufacturing Thereof, to be disclosed to University of Colorado Technology Transfer Office, April 2009.

12.  Ronggui Yang, Variable Thermal Resistors, to be disclosed to University of Colorado Technology Transfer Office, April 2009.

 

e). Journal Papers Published and In Press

2009

1.      Mark Siemens, Qing Li, Ronggui Yang, Keith A. Nelson, Eric Anderson, Margaret Murnane, and Henry Kapteyn, Quasi-ballistic thermal transport from nanoscale interfaces observed using ultrafast coherent soft X-ray beams, Nature Materials, in Press.

2.      Xiaoying Huang, Mojgan Roushan, Thomas J. Emge, Wenhua Bi, Suraj Joottu Thiagarajan, Jen-Hau Cheng, Ronggui Yang, Jing Li, Flexible Hybrid Semiconductors Having Very Low Thermal Conductivity: The Role of Organic Diamines, Angewandte Chemie International Edition (submitted in June 2009 and accepted August 5, 2009), Vol. 121, pp. 8011-8014, September 2009. PDF.

3.      Liang-Chun Liu, Mei-Jiau Huang, Ronggui Yang, Ming-Shan Jeng, and Chang-Chung Yang, Curvature Effect on the Phonon Thermal Conductivity Reduction of Dielectric Nanowires, Journal of Applied Physics, Vol. 105, n10, Art # 104313, May 2009. PDF. It has also been selected for the June 8, 2009 issue of Virtual Journal of Nanoscale Science & Technology (Vol. 19, n23) http://www.vjnano.org..

4.      Yadong Zhang, Yu-Zhong Zhang, David C. Miller, Jacob A. Bertrand, Ronggui Yang, Martin L. Dunn, Steven M. George and Y. C. Lee, Fluorescent Tags to Visualize Defects in Al2O3 Thin Films Grown Using Atomic Layer Deposition, Thin Solid Films, Vol. 517, pp. 6794-6798, October 2009 (published online in May 2009). PDF.

5.      Nicholas Allec, Zyad Hassan, Li Shang, Robert P. Dick, Vishak Venkatraman and Ronggui Yang, “ThermalScope: Multi-scale Thermal Analysis for Nanometer-scale Integrated Circuits,” IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems, Vol. 28, n6, pp. 860-873, 2009, PDF

6.      David C. Miller, Ross R. Foster, Yadong Zhang, Shih-Hui Jen, Jacob A. Bertrand, Zhixing Lu, Dragos Seghete, Jennifer L. O’Patchen, Ronggui Yang, Yung-Cheng Lee, Steven M. George, and Martin L. Dunn, The Mechanical Robustness of Atomic-Layer and Molecular-Layer Deposited Coatings on Polymer Substrates, Journal of Applied Physics, Vol. 105, n9, Art # 093527, May 2009, PDF.

7.      Suresh Ramanan and Ronggui Yang, Effect of Gas Rarefaction on the Performance of Submicron Fins, Applied Physics Letters, Vol. 94, Art# 143106, 2009, PDF. It has also been selected for the April 27, 2009 issue of Virtual Journal of Nanoscale Science & Technology (Vol. 16, n17) http://www.vjnano.org.

8.      Mark Siemens, Qing Li, Margaret Murnane, Henry Kapteyn, Ronggui Yang, Erik Anderson, and Keith Nelson, High-Frequency Surface Acoustic Wave Propagation in Nanostructures Characterized by Coherent Extreme Ultraviolet Beams, Applied Physics Letters Vol. 94, Art # 093103, 2009 PDF. It has also been selected for the March 16, 2009 issue of Virtual Journal of Nanoscale Science & Technology (Vol. 16, n9) http://www.vjnano.org.

9.      Yadong Zhang, Jacob A. Bertrand, Ronggui Yang, Y. C. Lee, and Steven M. George, Electroplating to visualize defects in Al2O3 thin films grown using atomic layer deposition, Thin Solid Films, Vol. 517, pp. 3269-3272, 2009 (published online in January 2009). PDF

10.  A. Evgrafov, K. Maute, R.G. Yang, and M.L. Dunn, Topology Optimization for Nano-scale Heat Transfer (Published online in July 2008), International Journal for Numerical Methods in Engineering, Vol. 77, pp. 285–300, 2009 PDF.

 

2008

11.  T. Borca-Tasciuc, D. G. Cahill, G. Chen, S. B. Cronin, H. Daiguji, C. Dames, K. Fushinobu, T. Inoue, A. Majumdar, S. Maruyama, K. Miyazaki, M. Matsumoto, P. M. Norris, L. Shi, M. Shibahara, M. Shannon, J. Shiomi, Y. Taguchi, K. Takahashi, T. Tsuruta, S. G. Volz, E. Wang, X. F. Xu, B. Yang, and R.G. Yang, “Report on 6th US-Japan Joint Seminar on Nanoscale Transport PhenomenaScience and Engineering’, Nanoscale and Microscale Thermophysical Engineering, Vol. 12, pp. 273-293, 2008, PDF

12.  Jianping Fu, Ronggui Yang, Gang Chen, G. Jeffrey Snyder and Jean-Pierre Fleurial, Integrated Electroplated Heat Spreaders for High Power Quantum Well Lasers, Journal of Applied Physics, Vol. 104, Art # 064907, 2008. PDF

13.  Ming-Shan Jeng, Ronggui Yang, David W. Song, and Gang Chen, Modeling the Thermal Conductivity and Phonon Transport in Nanoparticle Composites using Monte Carlo Simulation, ASME Journal of Heat Transfer, Vol. 130, Article #042410 (1-11), April 2008, PDF. This paper is among the 10 most downloaded articles among all online JHT papers (published in 1990-present) in May 2008, in June 2008, in September 200, in October 2008, in November 2008, in December 2008, in January 2009,  in February 2009, in March 2009, in April 2009, and in May 2009 (ASME Journal of Heat Transfer website).

14.  Weixue Tian and Ronggui Yang, Phonon Transport and Thermal Conductivity Percolation in Random Nanoparticle Composites (Invited Paper), Computer Modeling in Engineering and Sciences (CMES), Vol. 24, p.123-141, 2008, PDF.

 

2007

15.  Weixue Tian and Ronggui Yang, Effect of Interface Scattering on Phonon Thermal Conductivity Percolation in Random Nanowire Composites, Applied Physics Letters 90, 263105, June 2007, PDF.  It has also been selected for the July 9, 2007 issue of Virtual Journal of Nanoscale Science & Technology (Vol. 16, n2) http://www.vjnano.org.

16.  M. S. Dresselhaus, G. Chen, M.Y. Tang, R.G. Yang, H. Lee, D.Z. Wang, Z. F. Ren, J. P. Fleurial, and P. Gogna, New Directions for Low Dimensional Thermoelectric Materials (Invited Review), Advanced Materials 19, pp.1043-1053, April 2007, PDF. This paper ranked as #2 of the top 20 most accessed articles in April 2007 (Advanced Materials journal website). According to the ISI Web of Science, this paper has been cited 132  times as of September 15, 2009 and ranks #1 in the citation record out of the total 753 papers published in this journal in 2007.

17.  Weixue Tian, and Ronggui Yang, Thermal Conductivity Modeling of Compacted Nanowire Composites, Journal of Applied Physics 101, 054320, March 2007. PDF

 

2006

 

2005

18.  Ronggui Yang, Gang Chen, and Mildred S. Dresselhaus, Thermal Conductivity of Simple and Tubular Nanowire Composites in the Longitudinal Direction, Physical Review B 72, 125418, 2005, PDF. It has also been selected for the Sep 26, 2005 issue of Virtual Journal of Nanoscale Science & Technology (Vol. 12, n13) http://www.vjnano.org. As of February 05, 2009, this paper has been cited 44 times and is one of the top 130 highly cited papers out of the total 6266 Physical Review B papers published in 2005.

19.  Ronggui Yang, Gang Chen, Marine Laroche and Yuan Taur, Multidimensional Transient Heat Conduction at Nanoscale using the Ballistic-Diffusive Equations and the Boltzmann Equation, ASME Journal of Heat Transfer, Vol. 127, pp.298-306, 2005, PDF. According to the ISI Web of Science, this paper has been cited 24 times as of June 15, 2009 and ranks #5  in the citation record out of the total 177 papers published in this journal in 2005.

20.  Ronggui Yang, Gang Chen, and Mildred Dresselhaus, Thermal Conductivity Modeling of Core-Shell and Tubular Nanowires, Nano Letters, Vol. 5, pp. 1111-1115, June 2005, PDF.

21.  Ronggui Yang, Arvind Narayanaswamy and Gang Chen, Surface Plasmon Coupled Nonequilibrium Thermoelectric Refrigerators and Power Generators, Journal of Computational and Theoretical Nanoscience, Vol. 2, pp. 75-87, 2005, PDF.

22.  Ronggui Yang and Gang Chen, Nanostructured Thermoelectric Materials: From Superlattices to Nanocomposites (Invited Review), Materials Integration 18; pp. 31-36, Feature issue on “Thermoelectric Materials R&D in the World”, PDF.

23.  Gang Chen, Ronggui Yang, and Xiaoyuan Chen, Nanoscale Heat Transfer and Thermoelectric Energy Conversion, Journal de Physique IV, Vol. 125, pp.499-504, 2005, PDF.

 

2004

24.  Ronggui Yang, Gang Chen, A. Ravi Kumar, G. Jeffrey Snyder and Jean-Pierre Fleurial, Transient Cooling of Thermoelectric Micro Coolers and its Applications, Energy Conversion and Management, Vol. 46, pp.1407-1421, 2005 (published in Sep. 2004), PDF.

25.  Ronggui Yang and Gang Chen, Thermal Conductivity Modeling of Periodic Two-Dimensional Nanocomposites, Physical Review B, Vol. 69, 195316 (1-10), 2004, PDF. As of June 15, 2009, this paper has been cited 78  times and is one of the top 50 highly cited papers out of the total 5110 Physical Review B papers published in 2004.

26.  Ronggui Yang, Gang Chen, G. Jeffrey Snyder, and Jean-Pierre Fleurial, Multistage Thermoelectric Micro Coolers, Journal of Applied Physics, Vol. 95, pp. 8226-8232, 2004, PDF. It has also been selected for the June 21, 2004 issue of Virtual Journal of Nanoscale Science & Technology (Vol. 9, n24) http://www.vjnano.org.

 

<2002

27.  G. Jeffrey Snyder, Jean-Pierre Fleurial, Thierry Caillat, Ronggui Yang and Gang Chen, Supercooling of Peltier Cooler using a Current Pulse, Journal of Applied Physics, Vol. 92, n3, pp.1564-1569, 2002, PDF.

28.  Ronggui Yang, Shuye Lei and Jianhua Du, Transport Phenomena in Unsaturated Porous Media Due to Sudden Heating, Journal of Tsinghua University (in Chinese), Vol.39 n6, p78-82, 1999

29.  Shuye Lei, Ronggui Yang and Jianhua Du, Research on Heat and Mass Transfer in Unsaturated Porous Media, Journal of Tsinghua University (in Chinese), Vol.39 n6, p.74-77, 1999.

30.  Lihe Chai and Ronggui Yang, Philosophical Perspective on Modeling Methods, Exploration of Nature (Chinese), Vol. 18, n2, pp. 87-90, 1999.

31.  Shuye Lei and Ronggui Yang, Seepage Model on Heat and Mass Transfer in Unsaturated Porous Media, Chinese Academic Journal, Vol. 4, n8, 1998.                     

 

f). Journal Papers in Review and in Preparation

32.  Sheng Shen, Ronggui Yang, and Gang Chen, Robert M Crone, and Manuel Anaya-Dufresne, Nonlocal Formulation of the Reynolds Equation for Rarefied Gas Flow With Steep Pressure Variation, Submitted to Journal of Micromechanics and Microengineering, September 2009.

33.  Jen-Hau Cheng, Dragos Seghete, Myongjai Lee, John B. Schlager, Kris A. Bertness, Norman A. Sanford, Ronggui Yang, Steven George and Y.C. Lee, “Atomic Layer Deposition Enabled Interconnect Technology for Vertical Nanowire Arrays,” Submitted to Sensors & Actuators A: Physical, September 2009.

34.  Dae Up Ahn, Ronggui Yang, Y.C. Lee, and Victor M. Bright, Spontaneous Controls of Cylindrical Block Copolymer Nanopatterns on Various Organic/Inorganic Substrates, Submitted to Chemistry of Materials, October 2009.

35.  Jun Zhou, Xiaobo Li and Ronggui Yang, A Model for Thermoelectric Transport in Nanocomposites, Submitted to Physical Review B, October 2009.

36.  Xiaobo Li and Ronggui Yang, Strain Effects on the Lattice Thermal Conductivity of Nanostructures, Submitted to Physical Review B, October 2009.

37.  Jun Liu and Ronggui Yang, Tuning the Thermal Conductivity of Polymers with Mechanical Strain, Submitted to Physical Review B, October 2009.

 

38.  Min Wu, Hongbin Yao, Thomas Emge, Jen-Hau Cheng, Suraj Thiagarajan, Ronggui Yang, Mark Croft, Xiaoying Huang, Jessica Rhee, Jing Li, An Iron Sulfide Hybrid Semiconductor with Unique 2D [Fe16S20]8- Layer and Low Thermal Conductivity,  to be submitted to Chemical Communications, October 2009

39.  Dae Up Ahn, and Ronggui Yang, Long-Range Attractive Interactions of Colloidal Particles at Air-Water Interface, to be submitted to Physical Review Letters, November 2009.

40.  Pilhwa Lee, Kurt Maute, and Ronggui Yang, An extended finite element method (XFEM) based topology optimization for nano-scale heat transfer, to be submitted to International Journal for Numerical Methods in Engineering, November 2009.

41.  Suresh Ramanan and Ronggui Yang, Rarefied Gas Flow and Heat Transfer in Micro-Channels under Constant Heat Flux Conditions using Monte Carlo and Information Preservation scheme, to be submitted to ASME Journal of Heat Transfer, November 2009.

42.  David Makhija, Georg Pingen, Kurt Maute, and Ronggui Yang, Topology Optimization of Micromixer Design by Multi-relaxation Time Lattice Boltzmann Method, to be submitted to Microfluidics and Nanofluidics, November 2009.

43.  C. Oshman, B. Shi, Chen Li, R.G. Yang, Y. C. Lee, and V.M. Bright, Fabrication and Testing of a Flat Polymer Micro Heat Pipe, to be submitted to IEEE/ASME Journal of Micro-Electrical-Mechanical Systems, December 2009.

44.  Jie Zhu, Jun Liu, Ronggui Yang and Dawei Tang, Frequency-domain pump-probe thermoreflectance technique for measuring thermophysical properties of thin films, to be submitted to Review of Scientific Instruments, December 2009

45.  Xiaobo Li and Ronggui Yang, Design of Thermoelectric Micro-Coolers considering the Parasitic Interface Thermal and Electric Resistances, to be submitted to Journal of Applied Physics, December 2009.

46.  Jen-Hau Cheng, John B. Schlager, Kris A. Bertness, Norman A. Sanford, Dragos Seghete, Steven George, Ronggui Yang and Y.C. Lee, Tip Temperature Measurement for As-Grown Gallium Nitride Nanowires Using Steady-State Photoluminescence, to be submitted to Nano Letters.

 

B). CONFERENCE PRESENATIONS AND PUBLICATIONS

a). Invited and Keynote Conference Presentations (after January 1, 2006)

2009

1.      Invited Review: Ronggui Yang, Modeling Phonon Transport in Complex Nanostuctures, ASME International Mechanical Engineering Congress & Exposition Symposium 14-1 “New Developments in Simulation Methods and Software for Engineering Applications", Orlando, FL, November 13-19, 2009

2.      Invited: Mark Siemens, Qing Li, Margaret Murnane, Henry Kapteyn, Ronggui Yang, Erik Anderson, and Keith Nelson “Extreme Ultraviolet light in the lab: applications to surface science”, Optical Society of America Laser Science Annual Meeting, San Jose, CA, October 2009, Presented by Mark Siemens.

3.      Invited: Ronggui Yang, “Nano-Enabled Energy Harvesting and Storage Systems for Aerospace Environment Integration”, AFOSR Workshop on Energy Harvesting and Storage, Arlington VA, April 17, 2009.

4.      Invited: Kurt Maute, Pilhwa Lee, Georg Pingen, and Ronggui Yang, Design Optimization of Transport Phenomena at Micro and Submicron Scale via Kinetic Theory Approaches, Conference on Multi-scale Modeling in Computational Mechanics, Rolduc, The Netherlands, March 11-13 2009, Presented by Kurt Maute.

 

2008

5.      Invited Panelist: Ronggui Yang, Thermoelectric Nanocomposites: A Cheaper Nanotech Solution to Cleaner and Quieter Global Energy, EmTech 2008 organized by MIT Technology Review, September 23-25, MIT campus, MA.

6.      Invited: Ronggui Yang, et al, Probing Nanoscale Thermal Transport using Extreme Ultraviolet (EUV) Light, 6th Japan- US Joint Seminar on Nanoscale Transport Phenomena - Science and Engineering,” July 13-16, 2008, Radisson Hotel, Boston, MA.

7.      Invited Poster: Xiaochun Wang, Ronggui Yang, Yong Zhang, Jean-Pierre Fleurial, Andrew F. May, and G. Jeffrey Snyder, First Principles Study on Thermoelectric Properties of Lanthanum Chalcogenides, 6th Japan- US Joint Seminar on Nanoscale Transport Phenomena - Science and Engineering,” July 13-16, 2008, Radisson Hotel, Boston, MA.

8.      Invited: Ronggui Yang, et al, Defect Decoration and Visualization for Atomic Layer Deposited Coatings, the 2nd Integration & Commercialization of Micro & Nanosystems International Conference & Exhibition, June 2008, Hongkong.

9.      Invited Tutorial: Margaret M. Murnane, Jorge Rocca, John Miao, Ronggui Yang, Keith Nelson, Eric Anderson, Martin Aeschlimann, Carmen Menoni, Mario Marconi, and Henry C. Kapteyn, “Harnessing Attosecond Science for Visualizing the Nanoworld,” Paper QMF1 OSA Conference on Lasers and Electro-optics/ Quantum Electronics and Laser Science (CLEO/QELS), San Jose, CA, May 2008. Presented by Margaret Murnane.

10.  Invited: Mark Siemens, Qing Li, Margaret Murnane, Henry Kapteyn, Ronggui Yang, Keith Nelson, Nanoscale Heat Transport Probed with Soft-X-Rays, Paper CWA6, OSA Conference on Lasers and Electro-Optics and the Quantum Electronics and Laser Science Conference (CLEO/QELS), May 2008, San Jose, CA, presented by Mark Siemens.

11.  Invited: Mark Siemens, Qing Li, Ra’anan Tobey, Oren Cohen, Margaret Murnane, Henry Kapteyn, Ronggui Yang, and Keith Nelson, Ultrasensitive, Ultrafast Holographic Detection of Thermal Transients with Extreme Ultraviolet Radiation, The Gordon Research Conference on Photoacoustic and Photothermal Phenomena 2008, Los Angeles, Feb 8-14, 2008

 

2007

12.  Ronggui Yang, Introduction to Nanoscale and Ultrafast Thermal Sciences and Applications Lab, DARPA Young Faculty Award Workshop, November 2007, Arlington VA, (invited poster presentation).

13.  Ronggui Yang, Surface-Plasmon Enabled High Efficiency Thermoelectric Devices, DARPA Young Faculty Award Workshop, November 2007, Arlington VA (invited seeding presentation).

14.  Invited: Ronggui Yang, Thermoelectric Transport in Nanocomposites, Session on Thermoelectrics, 7th Pacific Rim Conference on Ceramic and Glass Technology, November 11-14, 2007, Shanghai, China

15.  Invited Workshop Talk: Henry Kapteyn, Margaret Murnane , Keith Nelson, John Miao, Martin Aeschlimann, Ronggui Yang, “Ultrafast Probes of Materials using Table-top Coherent EUV Beams,” Division of Materials Sciences and Engineering Council Workshop on Ultrafast Materials Science, Santa Fe, NM, October 2007, Presented by Henry Kapteyn.

16.  Research Update: Mark Siemens, Luis Avila, Xibin Zhou, Wen Li, Nick Wagner, Robynne Hooper, Qing Li, Jing Yin, Etienne Gagnon, Arvinder Sandhu, Ronggui Yang, Henry Kapteyn, Margaret Murnane, Erik Anderson, Keith Nelson, Martin Aeschlimann, “Ultrafast Probes of Molecules and Materials using Table-top Coherent EUV Beams,” 2007 Retreat of the NSF Engineering Research Center in Extreme Ultraviolet Science and Technology, Estes Park, CO, October 2007. Presented by Henry Kapteyn.

 

2006

17.  Keynote: Ronggui Yang, Thermoelectric Transport in Nanocomposites, International Conference on Innovative Solutions for the Advancement of the Transport Industry, Oct 4-6, 2006 .

18.  Invited: Ronggui Yang, Thermoelectric Transport in Nanocomposites, Fourth International Workshop On Polymer Routes to Multifunctional Ceramics for Advanced Energy and Propulsion Applications, July 30-August 05, 2006, Boulder, CO.

19.  Keynote Talk: Z. F. Ren, D. Z. Wang, B. Poudel, Yi Ma, Wenzhong Wang, Xiao Yan, Lili Chen, Bo Yu, Gang Chen, M. S. Dresselhaus, H. Lee, Q. Hao, R. G. Yang, M. Y. Tang, J. P. Fleurial, and P. Gogna, “Nanocomposite approach to high figure-of-merit thermoelectric materials”, ASME 1st Energy Nanotechnology International Conference (ENIC2006, Keynote), June 25 - 28, 2006, MIT, presented by Z.F. Ren.

20.  Invited: Ronggui Yang, Gang Chen, M.S. Dresselhaus, J.P. Fleurial, and P. Gogna, Nanocomposite Engineering for High Efficiency Thermoelectric Materials, the 5th Joint Meeting of Overseas Chinese Physicists Worldwide - International Conference on Physics education and Frontier Physics (OCPA06), June 25-30, 2006, Taipei, Taiwan.

21.  Research Update, Henry Kapteyn, Elliot Bernstein, Steve Leone, Dan Dessau, John Gland, Chris Greene, Tamar Seideman, Martin Aeschlimann, Ronggui Yang, Keith Nelson, Ivan Christov, Barry Walker, Tom Silva, and Rich Mirin, “Novel linear and nonlinear spectroscopies using small-scale EUV light sources,” NSF Engineering Research Center for Extreme Ultraviolet Science and Technology Annual Site Visit, May 2006. Presented by H. Kapteyn.

22.  Invited Tutorial: M.S. Dresselhaus, G. Chen, J. Heremans, R.G. Yang, and G. Dresselhaus, Low Dimensional Thermoelectricity, Tutorial at 2006 APS March Meeting, March 12, 2006, Baltimore, MD, presented by M.S. Dresselhaus.

 

b). Contributed Conference Presentations and Papers (Denoted in the list if there is a [Referred Paper] along with the presentation.)

2010

1.      [Referred Paper] Jen-Hau Cheng, John Schlager, Kris Bertness, Norman Sanford, Dragos Seghete, Steven George, Ronggui Yang and Y.C. Lee, “Thermal Management of Vertical Gallium Nitride Nanowire Array Devices: Cooling Design and Tip Temperature Measurement,” IEEE/MEMS Conference, Hongkong, January 25-29, 2010.

2.      [Referred Paper] Chingyi Lin, Yadong Zhang, Aziz Abdulagatov, Ronggui Yang, Martin Dunn, Victor Bright, Steven George, Y.C. Lee, “ALD Hermetic Sealing for Polymer-Based Wafer Level Packaging of MEMS,” IEEE/MEMS Conference, Hongkong, January 25-29, 2010.

3.      [Referred Paper] Sreekant Narumanchi, Suraj Thiagarajan, Kenneth Kelly, Charles King and Ronggui Yang, Heat Transfer Performance of Enhanced Surfaces for Power Electronics Cooling Applications (IHTC14-23284), International Heat Transfer Conference, Washington DC, August 8-13, 2010.

4.      [Referred Paper] Jie Zhu, Dawei Tang, and Ronggui Yang, Frequency-Domain Pump-and-Probe Thermoreflectance Technique for Measuring Thermal Conductivity and Interface Thermal Conductance of Thin Films (IHTC14-22522), International Heat Transfer Conference, Washington DC, August 8-13, 2010.

5.      [Referred Paper] Xiaobo Li, Jun Liu, and Ronggui Yang, Tuning the Thermal Conductivity using Mechanical Strains (IHTC14-23334), International Heat Transfer Conference, Washington DC, August 8-13, 2010.

 

2009

1.      Mark Siemens, Qing Li, Margaret Murnane, Henry Kapteyn, Ronggui Yang, and Keith Nelson,Time-resolved measurement of quasi-ballistic heat transport across nanoscale interfaces, 2009 Summer Heat Transfer Conference, July 19-23, 2009, San Francisco, CA

2.      Pilhwa Lee, Kurt Maute, and Ronggui Yang, “An extended finite element method (XFEM) for nano-scale heat transfer,” Proceedings of 2009 NSF Engineering Research and Innovation Conference, Honolulu, Hawaii, June 22-25, 2009.

3.      Pilhwa Lee, Kurt Maute, and Ronggui Yang, An extended finite element method (XFEM) based topology optimization for nano-scale heat transfer, the U.S. National Congress on Computational Mechanics (USNCCM X), July 16-19, 2009, Columbus, OH.

4.      Xiaobo Li and Ronggui Yang, Stain Effects on the Thermal Conductivity of Nanostructures, 17th Symposium on Thermophysical Properties, June 21-26, 2009, Boulder, CO

5.      Mark Siemens, Qing Li, Margaret Murnane, Henry Kapteyn, Ronggui Yang, Erik Anderson, and Keith Nelson, Time-Resolved Quasi-Ballistic Heat Transport at Nano-Interfaces, 17th Symposium on Thermophysical Properties, June 21-26, 2009, Boulder, CO.

6.      Pilhwa Lee, Kurt Maute, and Ronggui Yang, An extended finite element method (XFEM) based topology optimization for nano-scale heat transfer, 17th Symposium on Thermophysical Properties, June 21-26, 2009, Boulder, CO.

7.      Mark Siemens, Qing Li, Margaret Murnane, Henry Kapteyn, Ronggui Yang, Erik Anderson, and Keith Nelson, EUV Detection of High-Frequency Surface Acoustic Waves, The Conference on Lasers and Electro-Optics (CLEO) and The International Quantum Electronics Conference (IQEC), May 31-June 5, 2009, Baltimore, MD

8.      [Referred Paper] C. Oshman, B. Shi, C. Li, R.G. Yang, Y.C. Lee, and V.M. Bright, Fabrication and Testing of a Flat Polymer Micro Heat Pipe, The 15th International Conference on Solid-State Sensors, Actuators and Microsystems (Transducers 2009), June 21 - 25, 2009, Denver, CO.

9.      Yadong Zhang, Yu-Zhong Zhang, David C. Miller, Jacob A. Bertrand, Shih-Hui Jen, Ronggui Yang, Martin L. Dunn, Steven M. George, and Y. C. Lee, Defect Inspection of ALD/MLD-Based Barrier Coatings, IMAPS/ACerS 5th International Conference and Exhibition on Ceramic Interconnect and Ceramic Microsystems Technologies (CICMT 2009), April 20-23, 2009, Denver, CO.

10.  Ching-Yi Lin, Ronggui Yang, Y. C. Lee, Aziz Abdulagatov, and Steven M. George, Flexible Thermal Ground Plane Enabled by ALD/MLD-Based Barrier Coatings, IMAPS/ACerS 5th International Conference and Exhibition on Ceramic Interconnect and Ceramic Microsystems Technologies (CICMT 2009), April 20-23, 2009, Denver, CO.

11.  David C. Miller, Ross R. Foster, Yadong Zhang, Shih-Hui Jen, Jacob A. Bertrand, Zhixing Lu, Dragos Seghete, Jennifer L. O’Patchen, Ronggui Yang, Yung-Cheng Lee, Steven M. George, and Martin L. Dunn, Mechanical Robustness of ALD/MLD-Based Barrier Coatings, IMAPS/ACerS 5th International Conference and Exhibition on Ceramic Interconnect and Ceramic Microsystems Technologies (CICMT 2009), April 20-23, 2009, Denver, CO.

12.  Bo Shi, Christopher Oshman, Aziz Abdulagatov, Myongjai Lee, Virginia Yong, Dae Up Ahn, Ching-Yi Lin, Wei Wang, Jen-Hau Cheng, Chen Li, Ronggui Yang, Victor Bright, Steven George, G.P. “Bud” Peterson, Y.C. Lee, Development of Micro/Nano-Enabled Flexible Thermal Ground Plane, Workshop on MEMS & Associated Microsystems, International Conference and Exhibition on Device Packaging, March 9 - 12, 2009, Scottsdale/Fountain Hills, Arizona

 

2008

13.  David C. Miller, Ross R. Foster, Yadong Zhang, Shih-Hui Jen, Jacob A. Bertrand, Zhixing Lu, Dragos Seghete, Jennifer L. O’Patchen, Ronggui Yang, Yung-Cheng Lee, Steven M. George, and Martin L. Dunn, “Mechanical Robustness of Atomic Layer Deposited and Molecular Layer Deposited Coatings for Microsystems and Flexible Electronics Applications,” Symposium I: Reliability and Properties of Electronic Devices on Flexible Substrates, Material Research Society (MRS) Symposium, Fall 2008, Boston, MA

14.  [Referred Paper] Nicholas Allec, Zyad Hassan, Li Shang, Robert P. Dick and Ronggui Yang, “ThermalScope: Multi-scale Thermal Analysis for Nanometer-scale Integrated Circuits,” International Conference on Computer-Aided Design (ICCAD), San Jose, November 10-13, 2008.

15.  Mark Siemens, Qing Li, Margaret Murnane, Henry Kapteyn, Ronggui Yang, and Keith Nelson, “Probing Quasi-Ballistic Heat Transport using Coherent EUV Beams,” Directed Energy Professional Society Ultrashort Pulse Laser Workshop, Boulder, CO, September 2008.

16.  [Referred Paper] Liang-Chun Liu, Mei-Jiau Huang, and Ronggui Yang, Curvature Effect on the Thermal Conductivity of Nanowires, 2008 Summer Heat Transfer Conference, August 10-14, 2008 Jacksonville, FL.

17.   Mark Siemens, Qing Li, Margaret Murnane, Henry Kapteyn, Ronggui Yang, and Keith Nelson, Nanoscale Heat Transport Probed with Soft X-Rays, XVI International Conference on Ultrafast Phenomena, June 9-13 2008, Italy (referred paper).

18.  Anton Evgrafov, Kurt Maute, Ronggui Yang and Martin Dunn, “Topology Optimization for Nano-Scale Heat Transfer,” 8th. World Congress on Computational Mechanics (WCCM8) and the 5th. European Congress on Computational Methods in Applied Sciences and Engineering (ECCOMAS 2008), 30 June - 4 July 2008, the Lido Island, Venice, Italy.

19.   [Referred Paper] Yadong Zhang, Yu-Zhong Zhang, David C. Miller, Jacob A. Bertrand, Ronggui Yang, Martin L. Dunn, Steven M. George and Y. C. Lee, Fluorescent Tag-Based Inspection of Barrier Coatings for OLEDs and Polymer Packages, NSTI Nanotech 2008, Boston, MA, June 1-5, 2008 (referred paper).

20.  [Referred Paper] Zhang, David C. Miller, Jacob A. Bertrand, Yu-Zhong Zhang, Ronggui Yang, Martin L. Dunn, Steven M. George and Y. C. Lee, Fluorescent Tag-Based Inspection of Barrier Coatings for OLEDs and Polymer Packages, Society for Information Display, 2008 International Symposium, Seminar and Exhibition May 18-23, 2008, Los Angeles, CA .

21.  Kurt Maute, Anton Evgrafov, Ronggui Yang, Martin Dunn, Topology Optimization of Nano- and Submicro-scale Heat Transfer, Proceedings of 2008 NSF Engineering Research and Innovation Conference, January 2008,  Knoxville, TN (un-referred paper).

22.  [Referred Paper] Ronggui Yang, Jen-Hau Cheng, Weixue Tian, Ming-Shan Jeng, and Gang Chen, Thermal Conductivity of Nanocomposites, ASME Micro/Nanoscale Heat Transfer International Conference (MNHT08), January 2008, Tainan, Taiwan.

 

2007

23.  Mark E. Siemens, Qing Li, Oren Cohen, Henry Kapteyn, Margaret Murnane, and Ronggui Yang, "Probing Quasi-ballistic heat transport using coherent EUV beams", Directed Energy Professional Society 2007, Ultrashort Pulse Laser Workshop, October 2007.

24.  Qing Li, Mark E. Siemens,  Oren Cohen, Henry Kapteyn, Margaret Murnane, Ronggui Yang, Probing Quasi-Ballistic Phonon Thermal Transport using Extreme Ultraviolet (EUV), Ultrafast Optics 2007, High Field Short Wavelength, September 2007.

25.  [Referred Paper] Weixue Tian and Ronggui Yang, Thermal Conductivity of Randomly Stacked Nanoparticle Composites, ASME-JSME Heat Transfer Conferences, Vancouver, Canada, August 2007.

26.   Ronggui Yang, Thermal Conductivity Modeling and Characterization of Nanocomposites and Nano-ceramics, AFOSR focused workshop on Ultra-High Temperature Ceramic (UHTC) Materials Menlo Park, CA, July 23-25, 2007.

27.  Y. Zhang, R. Yang, S.M. George and Y.C. Lee, Atomic Layer Deposition for Hermetic Polymer Packages, (abstract #1637), NSTI Nanotechnology Conference and Trade Show, May 20-24, 2007, Santa Clara, California (Un-Referred Paper)

28.   Ronggui Yang, G.P. “Bud” Peterson, Chen Li, Victor Bright, Y.C. Lee, Martin Dunn, Steven M. George, Kurt Maute, Margaret M. Murnane, and Henry Kapteyn, Thermal Challenges and Innovations in Emerging Micro/Nano Systems, DARPA Microsystems Technology Symposium, March 3-5, 2007, San Jose, CA.

29.  Weixue Tian and Ronggui Yang,  Monte Carlo simulation of thermal conductivity in randomly distributed nanowire composites (A43.00009), American Physical Society March Meeting, Denver CO, 2007.

30.  Ming Tang , Hohyun Lee , Asegun Henry , Ronggui Yang , Dezhi Wang , Jean-Pierre Fleurial , Pawan Gogna , Gang Chen , Zhifeng Ren , Mildred Dresselhaus, Thermoelectric properties of Si-Ge nanoparticle composites (N43.00009), American Physical Society March Meeting, Denver CO, 2007.

 

2006

31.  [Referred Paper] Ming Y. Tang, Mildred S Dresselhaus, Gang Chen, and Ronggui Yang, Thermoelectric Modeling of Si Nanoparticle Composites, December 1, 2006 Fall MRS Meeting at Boston.

32.   Ronggui Yang, “Some Ideas on Variable Thermal Resistors”, DARPA Workshop on Variable Thermal Resistors, Boulder, CO, October 2006, (invited 45 minutes individual presentation to Program Manager Dr. Tom Kenny).

33.   Ronggui Yang, Thermoelectric Transport in Nanocomposites, Multifunctional NANOcomposites 2006 International Conference, ASME Nano-Institute, Honolulu, Hawaii, Sept. 20-22, 2006.

34.  Gang Chen, X.Y. Chen, Z. Chen, L. Hu, A. Narayanaswamy, and R.G. Yang, Thermally-Excited Nonequilibrium Between Electrons and Phonons for Energy Conversion, Nanoscale Energy Conversion and Information Processing Devices, Nice, France, September 24-26, 2006, (invited oral presentation).

35.   Ronggui Yang, Thermoelectric Transport in Nanocomposites, 16th Symposium on Thermophysical Properties, Boulder, CO, July 30-Aug. 04, 2006.

36.   Ronggui Yang, and Gang Chen, Thermoelectric Transport in Nanocomposites, SAE 2006 World Congress, Detroit, MI, April 3-5, 2006.

37.  G. Chen, R. Yang, M.S. Dresselhaus, et al, The Nanocomposite Approach to Enhanced
Thermoelectric Performance (B35.00003), 2006 APS March Meeting, Baltimore, MD, March 13–17, 2006.

 

Before 2005

38.  [Referred Paper] M.S. Dresselhaus, G. Chen, M.Y. Tang, Ronggui Yang, D.Z. Wang, Z.F. Ren, J.P. Fleurial, and P. Gogna, New Directions for Nanoscale Thermoelectric Materials Research (invited), Proc. MRS Fall Meeting, paper # F1.1, Boston, MA, 2005.

39.  [Referred Paper] Ming Y. Tang, M. S. Dresselhaus, Ronggui Yang, and Gang Chen, Thermoelectric Modeling of Si-Si1-xGex Ordered Nanowire Composites, Proc. MRS Fall Meeting, Boston, MA, 2005.

40.  G. Chen, R.G. Yang, et al, Design, Modeling, and Synthesis of Nanocomposites for Solid-State Energy Conversion, SPIE Optic East - Nanofabrication: Technologies, Devices, and Applications, Boston, October 23-26, 2005 (invited oral presentation).

41.   Ronggui Yang, Xiaoyuan Chen, Aaron Schmidt, and Gang Chen, Pump-Probe Experimental Study of Phonon Reflectivity at an Interface and Phonon Relaxation Time  (Nano2005-87064), ASME 4th Integrated Nanosystems – Design, Synthesis, & Applications, UC-Berkeley, September 14-16, 2005, (extended abstract).

42.   Ronggui Yang, and Gang Chen, Non-local Formulation of Rarefied Poiseuille Flow (Nano2005-87072), ASME 4th Integrated Nanosystems – Design, Synthesis, & Applications, UC-Berkeley, September 14-16, 2005, (extended abstract).

43.  [Referred Paper] G. Chen, R.G. Yang, et al, Engineering Phonon and Electron Transport in Nanocomposites for Solid-State Energy Conversion (invited), Proceedings of the 5th International Workshop on Structural Health Monitoring, Ed. Fu-Kuo Chang, pp. 1443-1450, Stanford, September 12-14, 2005.

44.  G. Chen, A. Narayanaswamy, Z. Chen, R.G. Yang, and L. Hu, Nanoscale Thermal Radiation: Fundamental Issues and New Opportunities, US-Japan Seminar on Nanoscale Heat Transfer, July 2005, (invited oral presentation)

45.   [Referred Paper] Ronggui Yang, Gang Chen and Mildred S. Dresselhaus, Thermal Conductivity of Core-Shell Nanostructures: from Nanowires to Nanocomposites (HT 2005-72198), ASME Heat Transfer Conference, San Francisco, July 2005.

46.   [Referred Paper] Ming-Shan Jeng, Ronggui Yang, and Gang Chen, Monte Carlo Simulation of Phonon Transport and Thermal Conductivity in Nanocomposites (IPACK 2005-73494), The ASME/Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems (InterPACK’05), San Francisco, July 2005.

47.   [Referred Paper] Ming-Shan Jeng, Ronggui Yang, and Gang Chen, Monte Carlo Simulation of Thermoelectric Properties in Nanocomposites, the 24th International Conference on Thermoelectrics (IEEE), Clemson University, Clemson SC, June 19-23, 2005.

48.  [Referred Paper] Hohyun Lee, Dezhi Wang, Wenzhong Wang, Zhifeng Ren, B. Klotz, Ming Y. Tang, Ronggui Yang, Pawan Gogna, Jean-Pierre Fleuiral, Mildred S. Dresselhaus, and Gang Chen, Thermoelectric Properties of Si/Ge Nano-composite, the 24th International Conference on Thermoelectrics (IEEE), Clemson University, Clemson SC, June 19-23, 2005.

49.  K. Miyazaki, H. Tsukamoto, R.G. Yang, and G. Chen, Thermal Conductivity of Nanostructured Material, Fifth International Conference on Enhanced, Compact and Ultra-Compact Heat Exchangers: Science, Engineering and Technology, Whistler, BC, Canada, Sep 11-15, 2005.

 

50.  Gang Chen, Ronggui Yang, Arvind Narayanaswamy, and Xiaoyuan Chen, Thermally-Excited Nonequilibrium States between Electrons and Phonons for Energy Conversion, the Second International Symposium on Micro/Nanoscale Energy Conversion and Transport (MECT-04), Seoul, Korea, August 8-13, 2004 (invited oral presentation).

51.   [Referred Paper] Ronggui Yang and Gang Chen, Thermal Conductivity Prediction of Periodic Nanocomposites using Phonon Boltzman Equation (HT-FED2004-5646), Proc. 2004 ASME Heat Transfer/Fluids Engineering Summer Conference (HTFED2004),  pp. 449-456, Charlotte, North Carolina, July 11-15, 2004.

52.   [Referred Paper] Ronggui Yang, Arvind Narayanaswamy and Gang Chen, Nonequilibrium Electron-Phonon Thermoelectric Devices using Surface Plasmon, Proc. the Sixth International Symposium of Heat Transfer (ISHT6), Beijing, China, June 15-19, 2004.

53.   [Referred Paper] Ronggui Yang and Gang Chen, Recent Developments in Nanostructured Thermoelectric Materials and Devices, Panel on "Challenges in Chip/Processor Level Thermal Engineering" at 9th IEEE/ASME Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITHERM2004), pp.731-732, Las Vegas, NV, June 1-4, 2004.

 

54.   [Referred Paper] Ronggui Yang and Gang Chen, Theoretical Thermal Conductivity of Nano-composites, in Thermoelectric Materials 2003, Research and Applications, vol 793, pp. 121-126, eds. G. S. Nolas and J. Yang and T. P. Hogan and D. C. Johnson. From the Materials Research Society Fall 2003 Meeting, Symposium S, Paper S5.2.

55.  [Referred Paper] G. Chen, C. Dames, T. Harris, D. Borca-Tasiuc, R.G. Yang, B. Yang, W.L. Liu, D. Song, and M. Takashiri, Thermal Conductivity Reduction Mechanisms in Superlattices (invited), Proc. International Thermoelectric Conference 2003 (IEEE), La Grande Motte, France, August 2003.

56.  [Referred Paper] Jianping Fu, Ronggui Yang, Gang Chen, G. Jeffrey Snyder, and Jean-Pierre Fleurial, Integrated Electroplated Heat Spreaders for High Power Quantum Well Lasers (TED-AJ03-332), Proc. 7th ASME/JSME Joint Thermal Engineering Conference (AJTE  2003), Hawaii, March 2003.

 

57.  [Referred Paper] Gang Chen and Ronggui Yang, Nano-to-Macroscale Transport Modeling through Approximations (IMECE2002-32120, invited), Proc. International Mechanical Engineering Conference and Exhibition (IMECE2002), pp. 61-68, New Orleans, Nov. 2002

58.   [Referred Paper] Ronggui Yang, Gang Chen, and Yuan Taur, Ballistic-Diffusive Equations for Multidimensional Nanoscale Heat Conduction, Proc. International Heat Transfer Conference (IHTC 2002), Grenoble, France, August 2002.

59.  [Referred Paper] R.G. Yang and G. Chen, Energy Conversion and Transport Near a Solid-Solid Interface, International Thermoelectric Conference 2002 (IEEE), Long Beach, CA, August 2002.

60.  Ronggui Yang, Diana Borca-Tasuica and Gang Chen, Heat Conduction and Energy Conversion in Nanoscale, Proc. The 20th Symposium on Energy Engineering Sciences, Argonne, IL, May 20-21, 2002.

61.  [Referred Paper] R.G. Yang, G. Chen, G.J. Snyder and J.-P. Fleurial, Design of two-stage Thick film Thermoelectric Micro Coolers for Mid-IR Lasers Thermal Management, Proc. 8th IEEE/ASME Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITHERM 2002),  pp. 323-329, San Diego, CA, May 2002.

 

62.   [Referred Paper] Ronggui Yang and Gang Chen, Two Dimensional Nanoscale Heat Conduction Using Ballistic-Diffusive Equations, Proc. International Mechanical Engineering Conference and Exhibition, Vol. 1: pp.363-366, New York, Nov. 2001.

63.   [Referred Paper] R.G. Yang, G. Chen, G.J. Snyder and J.-P. Fleurial, Geometric Effects On the Transient Cooling of Thermoelectric Coolers, Proc. Material Research Society Fall 2001 Meeting, pp. 281-286, Boston, MA, Nov. 2001.

64.  [Referred Paper] A. Ravi Kumar, R.G. Yang, G. Chen, and J. P. Fleurial, Transient Thermoelectric Cooling for Thin Film Devices, Proc. IEEE International Symposium on Circuits and Systems, v 4, 2001, p Z1141-Z1146 (MRS Spring 2000 meeting).

 

65.  [Referred Paper] Ronggui Yang, Shuye Lei and Jianhua Du, Heat and Mass transfer in Low Moisture-content Saturated Porous Media During Sudden Heating: I. Fundamentals, Proceedings of 5th ASME/JSME Joint Thermal Engineering Conference (AJTE1999), San Diego, California, March 1999.

66.  [Referred Paper] Ronggui Yang, Jianhua Du and Shuye Lei, Heat and Mass Transfer in Low Moisture- content Saturated Porous Media during Sudden Heating: II. Numerical Simulation, Proceedings of 5th ASME/JSME Joint Thermal Engineering Conference (AJTE 1999), San Diego, California, March 1999.

67.  [Referred Paper] Shuye Lei, Chunmei Xia, Ronggui Yang and Yong Cao, Numerical Simulation and Analysis of Process in Unsaturated Porous media for Measuring Thermal Conductivity with Transient Heat Probe, 5th Asian Thermal Property Conference, Sep. 1998, Seoul Korea.

68.  [Referred Paper] Ronggui Yang, Jianhua Du and Shuye Lei, Seepage Model on Simultaneous Transport of Heat-Water-Air-Solute in Porous Media, 12th Hydrodynamics Conference (in Chinese), August 1998.

69.   [Referred Paper] Shuye Lei, Ronggui Yang and Jianhua Du, Transport Theory in Unsaturated Porous Media, Annual Heat and Mass Transfer Conference of Chinese Engineering Thermophysics Society (in Chinese), 1998.

70.  [Referred Paper]  Ronggui Yang, Jianhua Du and Shuye Lei, Numerical Simulation of the Transport Phenomena in Porous Media, Annual Heat and Transfer Conference of Chinese Engineering Thermophysics Society (in Chinese), 1998.

71.  [Referred Paper]  Ronggui Yang, Jianhua Du and Shuye Lei, Solute Effect on Heat and Moisture Transfer in Unsaturated Porous Media, Annual Heat and Transfer Conference of Chinese Engineering Thermophysics Society (in Chinese), 1998.

72.  [Referred Paper] Shuye Lei, Guanyu Zheng, Buxuan Wang, Ronggui Yang and Chunmei Xia, Numerical Simulation of the Transport Phenomena Due to Sudden Heating in Porous Media, ASME 31st National Heat Transfer Conference (NHTC 1997), Baltimore, Maryland, August 1997.

73.  [Referred Paper] Shuye Lei, Chunmei Xia, Ronggui Yang and Yong Cao, Analysis of Unsaturated Porous Media Thermal Conductivity Measurement, Annual Heat and Transfer Conference of Chinese Engineering Thermophysics Society (in Chinese), Oct. 1997.

 

 

C). INVITED SEMINARS

1.      June 1, 2009, Challenges and Opportunities in Nanoscale Heat Transfer, Department of Physics, Xiamen University.

2.       June 26, 2008, Nanoscale Heat Transfer: Challenges and Opportunities, National Renewable Energy Lab, Golden, CO [Host: Dr. Sreekant Narumanchi and Dr. Kenneth Kelly].

3.      June 4, 2008, Challenges and Opportunities in Nanoscale Heat Transfer, Department of Mechanical Engineering, Hongkong University of Science and Technology [Host: Dr. Zhigang Li].

4.      March 28, 2008, Challenges and Opportunities in Nanoscale Heat Transfer, Department of Mechanical Engineering, University of Toledo [Host: Dr. Calvin H. Li].

5.      May 2007, Nanotechnological Innovations in Thermoelectric Energy Conversion and Thermal Management, Beijing University, Tsinghua University, Zhongshan University, sponsored by National Natural Science Foundation of China [Host: Prof. Xiaofeng Peng at Tsinghua University]. 

6.      March 22, 2007, Nanotechnological Innovations in Thermoelectric Energy Conversion and Thermal Management, CU Building Systems Seminar Series, University of Colorado at Boulder.

7.      May 17, 2006, Nanoscale and Ultrafast Thermal Sciences and Applications, National Renewable Energy Lab (Golden, CO) [Host: Dr. Mark Hanna and Dr. Chuck Kutscher]

8.      April 12, 2006, Nanoscale Heat Transfer and Energy Conversion, CU Energy and Environment Seminar Series, University of Colorado at Boulder [Host: Drs. Shelly L. Miller and Mike Hannigan].

9.      March 16, 2006, Nanoscale and Ultrafast Thermal Sciences and Applications, Department of Chemistry, University of Colorado at Boulder [host: Dr. Steven M. George].

10.  Feb. 13, 2006, Nanoscale and Ultrafast Thermal Sciences and Applications, Materials Reliability Division, National Institute of Standards and Technology (NIST-Boulder) [Host: Dr. Wood Johnson].

11.  Feb. 03, 2006, Nanoscale and Ultrafast Thermal Sciences and Applications, JILA/Physics Department, University of Colorado at Boulder [host: Drs. Margaret M. Murnane and Henry Kapteyn].

12.  Dec. 02, 2005, Nanoscale Heat Transfer with Applications in Nanoelectronics, Department of Electrical and Computer Engineering, Tufts University.

13.  May 13, 2005, Nanoscale Heat Transfer with Applications in Nanoelectronics and Thermoelectrics, Intel Corporation – Assembly Technology Development, Arizona

14.  April 4, 2005, Nanoscale Heat Transfer with Applications in Nanoelectronics and Thermoelectrics, University of Notre Dame.

15.  March 31, 2005, Nanoscale Heat Transfer with Applications in Nanoelectronics and Thermoelectrics, University of Colorado – Boulder.

16.  March 22, 2005, Nanoscale Heat Transfer with Applications in Nanoelectronics and Thermoelectrics, University of Houston.

17.  March 17, 2005, Nanoscale Heat Transfer with Applications in Nanoelectronics and Thermoelectrics, University of Illinois – Urbana Champaign.

18.  March 01, 2005, Nanoscale Heat Transfer with Applications in Nanoelectronics and Thermoelectrics, University of Wisconsin.

19.  Feb. 24, 2005, Nanoscale Heat Transfer with Applications in Nanoelectronics and Thermoelectrics, the City College of New York.

20.  Feb. 17, 2005, Nanoscale Heat Transfer with Applications in Nanoelectronics and Thermoelectrics, SUNY-Stony Brook.

1.      Dec. 20, 2004, Nanoscale Heat Transfer with Applications in Nanoelectronics and Thermoelectrics, Columbia University.